This invention provides an improved ink flow path between an ink reservoir and vaporization chambers in an inkjet printhead. In the preferred embodiment, a barrier layer containing ink channels and vaporization chambers is located between a rectangular substrate and a nozzle member containing an array of orifices. The substrate contains two linear arrays of heater elements, and each orifice in the nozzle member is associated with a vaporization chamber and heater element. The ink channels in the barrier layer have ink entrances generally running along two opposite edges of the substrate so that ink flowing around the edges of the substrate gain access to the ink channels and to the vaporization chambers.

Ink delivery system for an inkjet printhead

The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in multi-layered targets (40). The parameters of the output pulses (62) are selected to facilitate substantially clean, simultaneous or sequential drilling or via formation in a wide variety of materials such as metals, organic dielectrics, and reinforcement materials having different thermal absorption characteristics in response to ultraviolet light. These parameters typically include at least two of the following criteria: high average power of greater than about 100 milliwatts measured over the beam spot area, a temporal pulse width shorter than about 100 nanoseconds, a spot diameter of less than about 50 microns, and a repetition rate of greater than about one kilohertz. The laser system (10) and method circumvent conventional depth of cut saturation limitations and can achieve an increased depth of cut per pulse in a target (40) formed of either single- or multi-layered material.

Ultraviolet laser system and method for forming vias in multi-layered targets

Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers are stacked, one on top of the other. At least one of the circuit layers comprise a substrate composed of a polymeric material capable of undergoing bonding such as a fluoropolymeric based substrate having vias therethrough and a circuit comprised of a layer of suitable conductive material. A fusible conductive bonding material (e.g., solder) or a noble metal is applied wherever electrical connections are desired. At least one other of the circuit layers comprises a cofired multilayer ceramic circuit having vias and circuits comprised of a layer of suitable conductive material with a fusible conductive bonding material (e.g., solder) or a noble metal applied wherever electrical connections are desired. Once stacked the circuits are subjected to lamination under heat and pressure to adhere each polymeric substrate to an adjacent ceramic substrate and to diffuse the noble metal or fuse the solder layers together to form an integral multilayer circuit having solid conductive interconnects.

Method of manufacturing a multilayer circuit board

A computer that can be electrically coupled to an adapter with wireless inductive connectors. The adapter has a first primary inductive connector that provides power and a second secondary inductive connector that receives digital signals. The computer has a first secondary inductive connector that can receive power and a second primary inductive connector that provides digital signals. The connectors are located within the adapter and computer, so that when the computer is placed adjacent to the adapter, the inductive connectors became electrically coupled.

Power connection scheme

Complex small objects such as ophthalmic lenses are quickly and accurately fabricated from plastic or glass blanks of ablatable material such as plastic or glass by cutting, shaping, and radiusing the blank entirely by laser light, using appropriate masks and focusing optics.

Manufacture of ophthalmic lenses by excimer laser

A method of ablating fluoropolymer composition materials is presented wherein it has been found that small holes (less than 100 νm) can be formed in fluoropolymer composition laminate materials using UV lasers (10) to direct laser light through a mask (12) focusing lens (14) and onto fluoropolymer laminate (16). The resulting holes can be used to produce vias and plated through-holes having smooth side walls with little or no debris or residue remaining in holes and minimal damage to the polymer. Thus, the vias and plated through-holes can be plated without further cleaning processes. In addition, the holes are formed at a relatively fast rate.

Method of laser drilling fluoropolymer materials

A flexible circuit laminate is presented comprising a microglass reinforced fluoropolymer layer sandwiched between a polyimide substrate and a copper conductive pattern. The glass reinforced fluoropolymer acts as a high bond strength adhesive between the polyimide and copper conductive pattern. The glass reinforced fluoropolymer also contributes to improved dimensional stability as well as improved electrical performance. Preferably, the microglass content is between about 4 to about 30 weight percent, and more preferably about 20 weight percent glass. In a method of making the flexible circuit laminate, the polyimide substrate undergoes a preferably alkaline microetching surface treatment, followed by rinsing, drying and lamination to the microglass reinforced fluoropolymer and copper layers.

Flexible circuit laminate and method of making the same

Inductive devices, i.e., transformers, coils, inductors, etc. are produced from a rolled flexible circuit. The flexible circuit is comprised of a dielectric substrate having a circuit pattern thereon. The circuit pattern is configured such that, upon rolling, one or more coils is formed thereby defining an inductor, transformer, etc. Additionally, these inductive devices may be easily shielded using a ground plane in the flexible circuit. The rolled flexible circuit may be secured in several ways including an adhesive or by using a thermoplastic bonding layer which acts to heat seal the circuit together. The inductive devices of the present invention may be wrapped or rolled about a permeable core which improves inductance. Inductor devices manufactured in accordance with the present invention have the advantages of being small, surface mountable, inexpensive to manufacture and being capable of insertion onto printed wiring boards using automated insertion equipment. The small size of the inductor devices permit the present invention to take up only small areas on the circuit board thereby conserving valuable "real estate" on the printed wiring board.

Inductive devices for printed wiring boards

A preferably low dielectric constant polymeric bonding layer is applied or bonded (i.e., laminated or coated) to at least one side of a preferably low dielectric constant polymeric delay line substrate. Preferably, the melting or softening point of the bonding film is lower than the melting or softening point of the substrate so that the application (e.g. lamination) step is carried out at a temperature which is above the softening point of the bonding film, but below the softening point of the substrate (thereby insuring the integrity of the delay line circuit). Thereafter, the delay line/bonding layer assembly is rolled up and head sealed so as to melt the bonding layer, thus heat sealing the delay line package. As the package heats up (in, for example, a tightly fitting die), the materials expand and provide sufficient pressure to bond the circuit together.

Fleischner Cathy A

Papers

Method of laser drilling fluoropolymer materials

Flexible circuit laminate and method of making the same

Inductive devices for printed wiring boards

Electronic signal time dealy device and method of making the same

Verfahren zur durchbohrung mit laser von fluorpolymer-materialien.