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福美 土橋

Publications -  5
Citations -  68

福美 土橋 is an academic researcher. The author has contributed to research in topics: Substrate (printing) & Card reader. The author has an hindex of 5, co-authored 5 publications receiving 68 citations.

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Patent

Semiconductor device, electrooptical device, and method for fabricating semiconductor device

TL;DR: In this article, the authors proposed a method to obtain a semiconductor device comprising a functional element, e.g. a thin film transistor or an organic electroluminescence element, in which voltage drop of wiring is controlled and the time constant is decreased while reducing the fabrication cost.
Patent

Device and its manufacturing method, electro-optical device, and electronic apparatus

TL;DR: In this article, the authors proposed a method of manufacturing a device wherein elements such as a TFT are dispersively arranged on a final substrate, and also to provide the device by the method, an electro-optical device, and an electronic apparatus.
Patent

Ic card and manufacturing method therefor

TL;DR: In this article, the authors proposed a solution to the problem of providing an IC card which makes it difficult to separate an IC chip from the IC card by laminating a plurality of substrates.
Patent

Method and apparatus of manufacturing electronic device

TL;DR: In this article, a manufacturing apparatus consisting of a laser device (101) for generating a laser beam (101a), masking means (102) including a mask substrate for making a beam spot of the laser beam into a proper shape, a first stage (300) for mounting a first substrate (301) which carries an object to be transferred, a second stage (200) was used to mounting a second substrate (201) to which the object was transferred, an adhesive application means (500) for applying an adhesive to the object, and a controller (700) for
Patent

Apparatus and method for exfoliation transfer, semiconductor device and ic card

TL;DR: In this paper, an apparatus for exfoliation transfer which can precisely conduct alignment regulation is proposed. But the alignment regulation has not yet been considered in this paper. And it is not known whether the proposed apparatus can be used to transfer an element chip to a transfer destination board.