PROBLEM TO BE SOLVED: To provide a method for conveniently producing hydrophobically modified inorganic oxide particles which do not strongly agglomerate and are excellent in flowability.SOLUTION: In the method, steps (1) to (6) are achieved in an order described below: (1) a reaction step to obtain a dispersion of inorganic oxide particles by conducting a sol-gel reaction in the presence of a basic catalyst; (2) a step to subject the inorganic oxide particles to the first surface treatment by adding a specified surface treatment agent to the dispersion of the inorganic oxide particles obtained by the reaction step; (3) a step to add a coagulating agent composed of a specified compound to the dispersion of the inorganic oxide particles having been subjected to the first surface treatment; (4) a step to recover the inorganic oxide particles having been subjected to the first surface treatment with filtration; (5) a step to dry the recovered inorganic oxide particles having been subjected to the first surface treatment; and (6) a step to subject the inorganic oxide particles having been subjected to the first surface treatment to the second surface treatment by adding a specified surface treatment agent to the inorganic oxide particles having been subjected to the first surface treatment after drying.

Method for producing surface-treated inorganic oxide particle

Spherical crystalline silica particles having a higher productivity, lower production cost, higher coefficient of thermal expansion, higher heat transmission rate, higher fluidity, higher dispersability, higher fill factor, low abrasiveness, and higher purity compared with the past and able to be applied in the semiconductor field and a process of production of the same are provided. Spherical crystalline silica particles containing 400 to 5000 ppm of aluminum and containing 80% or more of crystal phases are provided.

Spherical crystalline silica particles and method for producing same

PROBLEM TO BE SOLVED: To provide a composition for polishing a semiconductor wafer which is less likely to cause haze and pits, especially the "remaining abrasive", in the plane of a wafer when the plane and the edge portion of a device wafer, or the like, are polishedSOLUTION: In the composition for polishing a semiconductor wafer containing colloidal silica produced from an active silicic acid, as a raw material, under existence of potassium ions, the colloidal silica contains potassium ions and aspherical heteromorphic silica particle group having a ratio of the long diameter/short diameter in the range of 12-10 observed by a transmission electron microscope Mirror polishing of the plane and the edge portion of a semiconductor wafer can be carried out effectively by using the composition for polishing a semiconductor wafer

Composition for polishing semiconductor wafer, production method therefor, and polishing method

The present invention provides a curable composition allowing a cured product having high aesthetic quality, strength and durability along with having high surface lubricating property. A curable composition in the present invention comprises: an inorganic powder and a polymerizable monomer, wherein the inorganic powder contains a spherical composite powder, the spherical composite powder has a complex of silicon dioxide and at least one of alumina and zirconia, and an amorphous part and a crystalline part are mixed in the spherical composite powder. A refractive index difference is not more than 0.05 between the spherical composite powder and a cured product obtained by curing only a compound excluded the spherical composite powder.

Curable composition and cured product for dental use

A new pozzolanic material basically conformed of microsilica with a minimum of silica of 85% in its composition is described, where the silica of the material is conformed mainly of cristobalite and tridimite. Unlike microsilica conformed basically of quartz, the microsilica of the invention exhibits greater pozzolanic indexes and provides improved characteristics of durability to concrete cements and in smaller proportions. Also simple and low consumption energy methods for obtaining the pozzolanic material of the invention are described.

Microsilica materials with improved pozzolanic activity

PROBLEM TO BE SOLVED: To provide a silica particle to become a resin filler capable of increasing the heat conductivity of a resin molding more than that of a conventional one and a method of manufacturing the same. SOLUTION: The silica particle has a spherical shape and ≥2 kinds of crystal forms selected from a group of α-quartz, tridymite and cristobalite. In the method of manufacturing the silica particle, the silica particle is manufactured by injecting a dispersion phase liquid in which silica sol is dispersed to a continuous phase liquid incompatible to the dispersion phase liquid through fine pores to prepare an emulsion, separating the dispersion phase from the emulsion to produce a cake and firing the cake obtained by the separation at ≥800°C to ≤1,300°C in the coexistence of a crystallization agent containing one kind of element selected from a group comprising Ca, Y, La and Eu. COPYRIGHT: (C)2005,JPO&NCIPI

Silica particle and method of manufacturing the same

PROBLEM TO BE SOLVED: To provide a method of manufacturing silica particles used as a resin filler which can raise heat conductivity of a resin molded article further than those of conventional ones. SOLUTION: The method of manufacturing silica particles comprises: a step in which a dispersed phase liquid made by distributing a silica sol is injected in a continuous phase liquid without compatibility with the dispersed phase liquid by making it pass through fine pores, so an emulsion is produced; a step in which a dispersed phase is separated from the emulsion to make a cake; and a step in which the cake obtained by separation is held at a temperature range of 800°C or more and 1,300°C or less to be calcinated under the coexistence of a crystallization agent containing one or more sorts of elements selected from the group consisting of Ca, Y, La, and Eu. COPYRIGHT: (C)2010,JPO&INPIT

Method of manufacturing silica particle

PROBLEM TO BE SOLVED: To provide a solid electrolyte material with its proton conductivity hardly affected by a moisture volume (humidity) at a wide temperature area from below freezing point to over 100°C, and developing conductivity under a non-humidified condition. SOLUTION: The proton conductive solid electrolyte, consisting of porous inorganic solid with pores with an average diameter of ≤100 nm, includes a functional group having active hydrogen on the inner faces of the pores and on the surface of the porous inorganic solid. The porous inorganic solid is preferably mainly composed of porous aluminosilica. COPYRIGHT: (C)2007,JPO&INPIT

Fukui Toshimi

Papers

Silica particle and method of manufacturing the same

Method of manufacturing silica particle

Proton conductive solid electrolyte