A review of two-phase submerged boiling in thermal management of electronic cooling

Review of Critical Heat Flux (CHF) in Jet Impingement Boiling

Experimental study on convective boiling flow and heat transfer in a microgap enhanced with a staggered arrangement of nucleated micro-pin-fins

Nanostructures on heat transfer surfaces can enhance micro/nanoscale phase-change heat transfer processes. To understand the enhancement mechanisms provided by nanostructures, evaporation processes of nanoscale liquid films on periodic sinusoidal-shaped surfaces were investigated via molecular dynamics simulations. By changing the amplitudes (A) and periods (T) of the curves describing the sinusoidal shapes, which possess shapes similar to j(x)=h0+Asin(2πx/T), sinusoidal surfaces of different sizes were constructed. An unevaporated region always existed on the copper plate for all surfaces during phase-change processes. Moreover, we calculated the interfacial thermal resistances and the mismatches between the vibrational density of states of the solid and liquid for different surfaces. The results show that the argon temperature changes and evaporation rates during the phase-change process on sinusoidal surfaces are higher than those on flat surfaces, and these results increase with the increase in amplitudes and the decrease in periods within certain limits mainly because of the thermal resistance decrease at the solid-liquid interface. Furthermore, the corresponding mismatches between the vibrational density of states of the solid and liquid also decrease, which indicates that the existence of sinusoidal nanostructures enhances the heat transfer of the phase-change process.

Molecular Dynamics Simulations of the Effects of Surface Sinusoidal Nanostructures on Nanoscale Liquid Film Phase-Change

• Passive and active cooling techniques for battery and electronic components cooling • Computational and experimental techniques for battery and electronic components cooling • Single phase coolant investigation • Geometry optimization concerning energy management • Flat plate, pin fin, and microchannel heat sink cooling investigation Heat sinks are considered as heat exchangers employed to cool high-temperature devices such as electronic components. They can significantly improve heat dissipation from the base surface. A wide range of heat sink geometries is categorized into three major types: flat-plate, pin-fin, and microchannel heat sinks. Over the past few decades, to keep up with the rate of electronics components heat flux, extensive examinations carried to enhance heat sinks thermal performance include various fabrication materials, single-phase coolants, geometry optimization, and designing complicated heat sink concepts. Heat sink optimization contributes a significant opportunity to improve thermal management and reduce energy consumption. Hence, developing and reviewing different heat sink research methodologies is fundamental. This paper reviews various research methodologies (using single-phase coolant) to aim for heat sink optimization and thermal performance enhancement in three geometry categories (flat-plate, pin-fin, and microchannel). The reviewed articles focused on experimental, numerical, and computational efforts on energy storage thermal managements utilizing single-phase coolant for flat-plate, pin-fin, and microchannel heat sinks design. 

Fulong Cui

Papers

Comparison of normal and distributed jet array impingement boiling of HFE-7000 on smooth and pin-fin surfaces

Two-phase flow instability in distributed jet array impingement boiling on pin-fin structured surface and its affecting factors