Power density of power electronic converters in different applications has roughly doubled every 10 years since 1970. Behind this trajectory was the continuous advancement of power semiconductor device technology allowing an increase of converter switching frequencies by a factor of 10 every decade. However, today's cooling concepts, and passive components and wire bond interconnection technologies could be major barriers for a continuation of this trend. For identifying and quantifying such technological barriers this paper investigates the volume of the cooling system and of the main passive components for the basic forms of power electronics energy conversion in dependency of the switching frequency and determines switching frequencies minimizing the total volume. The analysis is for 5 kW rated output power, high performance air cooling, advanced power semiconductors, and single systems in all cases. A power density limit of 28 kW/dm3@300 kHz is calculated for an isolated DC-DC converter considering only transformer, output inductor and heat sink volume. For single-phase AC-DC conversion a general limit of 35 kW/dm3 results from the DC link capacitor required for buffering the power fluctuating with twice the mains frequency. For a three-phase unity power factor PWM rectifier the limit is 45 kW/dm3@810 kHz just taking into account EMI filter and cooling system. For the sparse matrix converter the limiting components are the input EMI filter and the common mode output inductor; the power density limit is 71 kW/dm3@50 kHz when not considering the cooling system. The calculated power density limits highlight the major importance of broadening the scope of research in power electronics from traditional areas like converter topologies, and modulation and control concepts to cooling systems, high frequency electromagnetics, interconnection technology, multi-functional integration, packaging and multi-domain modeling and simulation to ensure further advancement of the field along the power density trajectory.

https://www.hpe.ee.ethz.ch/uploads/tx_ethpublications/IEEJ_PowerDensity_Paper_FinalRevised_03.pdf

PWM Converter Power Density Barriers

https://www.jstage.jst.go.jp/article/ieejias/128/4/128_4_468/_pdf

Results of thermodynamic characteristics of the combined cooling system consisting of a thermoelectric cooler and a jet cooler in the form of a vortex tube have been given. General relations for their description based on the exergetic method of thermodynamic system calculations have been obtained. Results supporting such devices efficiency have been presented. Experimental results of such system variations study have been given. Possibilities of their use in flying vehicles for electronic equipment cooling have been considered.

G.A. Smolyar

Papers

Thermoelectric coolers with vortex apparatus