A modular microchannel heat exchanger for cooling a heated region and a method for making the device. A first section of the device features an array of thin copper sheets which are etched with rows of elongated holes that pierce the sheets, coated with silver and held together with the holes aligned. These holes form a microchannel having a desired aspect ratio. A second section of the device has a series of thin copper plates which are etched as apertures, coated with silver and stacked in a sequence on the sheets of the first section, the plate closest to the sheets having elongated apertures oriented transversely to the microchannel of the sheets, the apertures combining further from the sheets into circular apertures to fit a coaxial inlet and outlet conduit where unitary or pipe flow occurs. The inlet conduit is, through the branching series of plates, in communication with alternately spaced elongated apertures adjacent to the microchannel of the sheets, and the outlet conduit is in communication with the other alternate elongated apertures. A case for both sections has an inlet and outlet chamber with holes that the inlet and outlet conduits plug into.

Modular microchannel heat exchanger

A cooling hat for transferring heat from a surface or plurality of heat generating components to a flowing fluid includes a coldsheet, a plurality of manifold layers and springs. The coldsheet is typically a medium-thin metal sheet usually with fine fins or grooves to readily transfer heat to a coolant. Each manifold layer is typically molded rubber with conduits for coolant supply and return. The conduits form a branched hierarchy. The fluid flow is highly parallel and streamlined which achieves ample flow with small hydraulic differential pressure. Springs gently urge the cooling hat against the thermal joints hence against the components. The hat can bend slightly to conform to a curved surface. Typically some compliance is provided by the hat, and other compliance is provided by a thermal joint between each component and the coldsheet. The system is highly self-aligned for counteracting variations.

Compliant fluidic coolant hat

A multi-layered cold plate is customized for cooling a plurality of electronic components to be arranged in thermal communication with the cold plate by dividing the cold plate into a plurality of hypothetical cooling zones, determining the cooling needed for the respective cooling zones for cooling the electronic components adjacent the zones, and tailoring a heat exchanger layer of the multi-layered cold plate with different heat exchanger structures in respective cooling zones to provide relatively high and relatively lower efficiency cooling where needed A coolant flow, jet impingement heat exchange structure formed of alternately stacked orifice plates and spacer plates provides the high efficiency cooling The heat exchanger layer is the only layer of the cold plate which must be customized for accommodating a particular arrangement of electronic components to be cooled

Cold plate for cooling electronics

The invention relates to a cooler for use as a heat sink for electrical components or circuits consisting of several cooler layers which are joined flat to one another, which are stacked on top of one another, which form between channels through which coolant flows and which each discharge into at least one first collection space for supply of the coolant and into a second collection space for draining the coolant, the collection spaces being formed by openings in the cooler layers and the cooling channels by structuring at least one area of the coolant layers with openings, the area being between the openings.

Cooler or heat sink for electrical components or circuits and an electrical circuit with this heat sink

A cooling apparatus includes first and second laminations each having a plurality of openings wherein the openings of the first and second laminations are substantially coincident when the laminations are disposed in identical orientations and the first lamination is aligned with and overlies the second lamination. The first and second laminations are bonded in a stacked and aligned relationship in different orientations such that passages are formed extending through the laminations.

Cooling apparatus and method of assembling same

An internally cooled semiconductor package including a wafer-like semiconductor body (diodes 12) with at least two electrical elements, one at a relatively flat surface (18) of the body. A wall (20, 22) if high electrical and heat conductive material abuts the flat surface of the semiconductor body to be in good heat conductive relation therewith and in electrical contact with the same. A fluid flow heat exchanger (10) is on the other side of the wall in heat exchange relation therewith and along with the wall and other components serves to encapsulate the semiconductor.

Gary J. Lutfy

Papers

Semiconductor package with internal heat exchanger.