The invention provides a microfabrication process which may be used to manufacture a MEMS device. The process comprises depositing one or a stack of layers on a base layer, said one layer or an uppermost layer in said stack of layers being a sacrificial layer; patterning said one or a stack of layers to provide at least one aperture therethrough through which said base layer is exposed; depositing a photosensitive layer over said one or a stack of layers; and passing light through said at least one aperture to expose said photosensitive layer.

A method for fabricating a structure for a microelectromechanical systems (mems) device

An interferometric modulator manufactured according to a particular set of processing parameters may have a non-zero offset voltage. A process has been developed for modifying the processing parameters to shift the non-zero offset voltage closer to zero. For example, the process may involve identifying a set of processing parameters for manufacturing an interferometric modulator that results in a non-zero offset voltage for the interferometric modulator. The set of processing parameters may then be modified to shift the non-zero offset voltage closer to zero. For example, modifying the set of processing parameters may involve modifying one or more deposition parameters used to make the interferometric modulator, applying a current (e.g., a counteracting current) to the interferometric modulator, and/or annealing the interferometric modulator. Interferometric modulators made according to the set of modified processing parameters may have improved performance and/or simpler drive schemes.

Process for modifying offset voltage characteristics of an interferometric modulator

In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device

Controlling electromechanical behavior of structures within a microelectromechanical systems device

An interferometric modulator is formed by a stationary layer and a mirror facing the stationary layer. The mirror is movable between the undriven and driven positions. Landing pads, bumps or spring clips are formed on at least one of the stationary layer and the mirror. The landing pads, bumps or spring clips can prevent the stationary layer and the mirror from contacting each other when the mirror is in the driven position. The spring clips exert force on the mirror toward the undriven position when the mirror is in the driven position and in contact with the spring clips.

System and method for micro-electromechanical operating of an interferometric modulator

Light in the visible spectrum is modulated using an array of modulation elements, and control circuitry connected to the array for controlling each of the modulation elements independently, each of the modulation elements having a surface which is caused to exhibit a predetermined impedance characteristic to particular frequencies of light. The amplitude of light delivered by each of the modulation elements is controlled independently by pulse code modulation. Each modulation element has a deformable portion held under tensile stress, and the control circuitry controls the deformation of the deformable portion. Each deformable element has a deformation mechanism and an optical portion, the deformation mechanism and the optical portion independently imparting to the element respectively a controlled deformation characteristic and a controlled modulation characteristic. The deformable modulation element may be a non-metal. The elements are made by forming a sandwich of two layers and a sacrificial layer between them, the sacrificial layer having a thickness related to the final cavity dimension, and using water or an oxygen based plasma to remove the sacrificial layer.

Method and device for modulating light

The sensor has a hollow space (6) defined between a transparent plate (1) and a silicon body (2), with 2 opposing mirrors (9, 12) on either side of this space (6). One of these mirrors (9) is attached to a silicon membrane (3) deflected in dependance on the measured parameter, the other mirror (12) attached to the transparent plate (1). At least one of the mirrors (9, 12) is made of platinum or a refractory metal, to prevent anodic bonding between the measuring membrane (3) and the plate (1) upon the mirrors (9, 12) being pressed together. A silicon oxide or silicon nitride stop layer (8) is provided between the measuring membrane (3) and the first mirror (9), both mirrors (9, 12) pref. having an anti-corrosion silicon nitride coating (13, 14). ADVANTAGE - Allows low-cost mass prodn.

Fabry=perot sensor for optical parameter measurement - uses two opposing mirrors respectively attached to deflected measuring membrane and transparent plate

Gasser Werner

Papers

Fabry=perot sensor for optical parameter measurement - uses two opposing mirrors respectively attached to deflected measuring membrane and transparent plate