scispace - formally typeset
G

Guoying Wei

Researcher at China Jiliang University

Publications -  7
Citations -  62

Guoying Wei is an academic researcher from China Jiliang University. The author has contributed to research in topics: Corrosion & Alloy. The author has an hindex of 1, co-authored 2 publications receiving 3 citations.

Papers
More filters
Journal ArticleDOI

A comparative study on the corrosion behavior of CoCrNi medium-entropy alloy and 316L stainless steel in simulated marine environment

TL;DR: In this paper, the difference in the corrosion resistance and passive property of CoCrNi medium-entropy alloy and 316L stainless steel in a simulated marine environment by using electrochemical measurements, immersion test and surface analysis technology was investigated.
Journal ArticleDOI

Study on corrosion behavior and mechanism of CoCrFeMnNi HEA interfered by AC current in simulated alkaline soil environment

TL;DR: In this paper, the corrosion behavior and mechanism of CoCrFeMnNiNi HEA interfered by AC current was investigated in carbonate/bicarbonate solution, and it was shown that AC application can destroy the structure of passive film, generate a change in the content of constitutes, and decrease the stability and protection ability of passive films.
Journal ArticleDOI

Effect of annealing temperature on microstructure and corrosion behavior of CoCrFeMnNi high-entropy alloy in alkaline soil simulation solution

TL;DR: In this paper , the effect of different annealing temperatures on the corrosion behavior of equiatomic CoCrFeMnNi high entropy alloy was investigated by electrochemical tests, immersion test, atomic force microscopy and X-ray photoelectron spectroscopy in alkaline soil simulation solution.
Journal ArticleDOI

A novel synthesis method for functionally graded alloy coatings by induced electrodeposition

TL;DR: In this article , a novel method for synthesis of functionally graded alloy coatings by using induced co-deposition has been proposed, where the graded NiCoW alloy was synthesized by one step, galvanostatic, direct current electrodeposition from a sulphate-citrate electrolyte.
Journal ArticleDOI

A novel diffusion barrier of electrodeposited CoWP layer between copper and silicon: Preparation and Performance

TL;DR: In this article , a novel diffusion barrier of electrodeposited CoWP layer was developed in order to solve the interconnection failure caused by the diffusion between copper and silicon in electrical circuit.