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H

H. Beutel

Researcher at Fraunhofer Society

Publications -  13
Citations -  552

H. Beutel is an academic researcher from Fraunhofer Society. The author has contributed to research in topics: Interconnection & Wire bonding. The author has an hindex of 9, co-authored 13 publications receiving 536 citations.

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Journal ArticleDOI

High density interconnects and flexible hybrid assemblies for active biomedical implants

TL;DR: In this paper, the microflex interconnection (MFI) technology was developed to achieve chip size package (CSP) dimensions without the requirement of using bumped flip chips (FC), and the MFI is based on a rivet like approach that yields an electrical and mechanical contact between the pads on the flexible polyimide substrate and the bare chips or electronic components.
Journal ArticleDOI

A flexible, light-weight multichannel sieve electrode with integrated cables for interfacing regenerating peripheral nerves

TL;DR: In this article, a new generation of flexible and extremely light-weight electrode arrays with integrated cables was developed, which overcomes the "classical" separation of substrate and insulation layers.
Journal ArticleDOI

“Microflex”—A New Assembling Technique for Interconnects

TL;DR: In this article, a new interconnection technique has been developed that allows versatile multiple strand connections between microsensors, sensor arrays, and chips designed for wire bonding, which can be used for wireless sensor arrays.
Proceedings ArticleDOI

Development of flexible stimulation devices for a retina implant system

TL;DR: In this article, the authors used polyimide as substrate and insulation layers and platinum as electrode and interconnect metallization layers for ganglion cell stimulation in the retina.
Journal ArticleDOI

Fast and precise positioning of single cells on planar electrode substrates

TL;DR: A new method for fast and efficient positioning of single cells on ring electrodes by controlled suction through holes is reported and the microfabrication of electrode substrates with microholes and the cell positioning procedure is described.