Preface. Microelectromechanical Systems (MEMS) and Radio Frequency MEMS. MEMS Materials and Fabrication Techniques. RF MEMS Switches and Micro Relays. MEMS Inductors and Capacitors. Micromachined RF Filters. Micromachined Phase Shifters. Micromachined Transmission Lines and Components. Micromachined Antennae. Integration and Packaging for RF MEMS Devices. Index.

RF MEMS and their applications

Distributed stochastic search and distributed breakout: properties, comparison and applications to constraint optimization problems in sensor networks

Through-wafer electrical connections are becoming increasingly important for three-dimensional integrated circuits, microelectromechanical systems packaging and radio-frequency components In this paper, we report our current results on the formation of through-wafer metal plugs using the copper electroplating technique Several approaches for via filling are investigated, such as filling before or after wafer thinning Among the methods experimented, the one-side Cu plating and bottom-up filling appears to be the most suitable technique for copper filling into high aspect ratio vias Using this method, we demonstrate the successful filling of vias with an aspect ratio of up to 7 Copper plugs as small as 20 × 20 μm2 are obtained uniformly over 4 inch Si wafers

https://iopscience.iop.org/article/10.1088/0960-1317/12/4/308/pdf

Through-wafer copper electroplating for three-dimensional interconnects

Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding. The fabrication process for wafer bonding at 300/spl deg/C via compressing gold under 7 MPa of pressure is described in detail. One of the issues encountered in the process development was e-beam source spitting, which resulted in micrometer diameter sized Au on the surfaces, and made bonding difficult. The problem was solved by inserting a tungsten liner to the graphite crucible. Surface segregation of Si on the Au surface at the bonding temperature was observed. Using Auger spectroscopy, a 1500 /spl Aring/ SiO/sub 2/ barrier layer was shown to be sufficient in preventing Si from reaching the surface. Lastly, a four-point bend delamination technique was used to quantify the bond toughness. The associated process steps that were required to prepare the test specimens are described. The critical strain energy release rate for the bonds ranged between 22 to 67 J/m/sup 2/ and was not shown to be strongly associated with the gold bond layer thickness in the thickness range studied (0.23 to 1.4 /spl mu/m).

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Fabrication of wafer-level thermocompression bonds

Preface. About the Authors. PART 1: FUNDAMENTALS. 1. Introduction to Smart Systems. 1.1 Components of a smart system. 1.2 Evolution of smart materials and structures. 1.3 Application areas for smart systems. 1.4 Organization of the book. References. 2. Processing of Smart Materials. 2.1 Introduction. 2.2 Semiconductors and their processing. 2.3 Metals and metallization techniques. 2.4 Ceramics. 2.5 Silicon micromachining techniques. 2.6 Polymers and their synthesis. 2.7 UV radiation curing of polymers. 2.8 Deposition techniques for polymer thin films. 2.9 Properties and synthesis of carbon nanotubes. References. PART 2: DESIGN PRINCIPLES. 3. Sensors for Smart Systems. 3.1 Introduction. 3.2 Conductometric sensors. 3.3 Capacitive sensors. 3.4 Piezoelectric sensors. 3.5 Magnetostrictive sensors. 3.6 Piezoresistive sensors. 3.7 Optical sensors. 3.8 Resonant sensors. 3.9 Semiconductor-based sensors. 3.10 Acoustic sensors. 3.11 Polymeric sensors. 3.12 Carbon nanotube sensors. References. 4. Actuators for Smart Systems. 4.1 Introduction. 4.2 Electrostatic transducers. 4.3 Electromagnetic transducers. 4.4 Electrodynamic transducers. 4.5 Piezoelectric transducers. 4.6 Electrostrictive transducers. 4.7 Magnetostrictive transducers. 4.8 Electrothermal actuators. 4.9 Comparison of actuation schemes. References. 5. Design Examples for Sensors and Actuators. 5.1 Introduction. 5.2 Piezoelectric sensors. 5.3 MEMS IDT-based accelerometers. 5.4 Fiber-optic gyroscopes. 5.5 Piezoresistive pressure sensors. 5.6 SAW-based wireless strain sensors. 5.7 SAW-based chemical sensors. 5.8 Microfluidic systems. References. PART 3: MODELING TECHNIQUES. 6. Introductory Concepts in Modeling. 6.1 Introduction to the theory of elasticity. 6.2 Theory of laminated composites. 6.3 Introduction to wave propagation in structures. References. 7. Introduction to the Finite Element Method. 7.1 Introduction. 7.2 Variational principles. 7.3 Energy functionals and variational operator. 7.4 Weak form of the governing differential equation. 7.5 Some basic energy theorems. 7.6 Finite element method. 7.7 Computational aspects in the finite element method. 7.8 Superconvergent finite element formulation. 7.9 Spectral finite element formulation. References. 8. Modeling of Smart Sensors and Actuators. 8.1 Introduction. 8.2 Finite element modeling of a 3-D composite laminate with embedded piezoelectric sensors and actuators. 8.3 Superconvergent smart thin-walled box beam element. 8.4 Modeling of magnetostrictive sensors and actuators. 8.5 Modeling of micro electromechanical systems. 8.6 Modeling of carbon nanotubes (CNTs). References. 9. Active Control Techniques. 9.1 Introduction. 9.2 Mathematical models for control theory. 9.3 Stability of control system. 9.4 Design concepts and methodology. 9.5 Modal order reduction. 9.6 Active control of vibration and waves due to broadband excitation. References. PART 4: FABRICATION METHODS AND APPLICATIONS. 10. Silicon Fabrication Techniques for MEMS. 10.1 Introduction. 10.2 Fabrication processes for silicon MEMS. 10.3 Deposition techniques for thin films in MEMS. 10.4 Bulk micromachining for silicon-based MEMS. 10.5 Silicon surface micromachining. 10.6 Processing by both bulk and surface micromachining. 10.7 LIGA process. References. 11. Polymeric MEMS Fabrication Techniques. 11.1 Introduction. 11.2 Microstereolithography. 11.3 Micromolding of polymeric 3-D structures. 11.4 Incorporation of metals and ceramics by polymeric processes. 11.5 Combined silicon and polymer structures. References. 12. Integration and Packaging of Smart Microsystems. 12.1 Integration of MEMS and microelectronics. 12.2 MEMS packaging. 12.3 Packaging techniques. 12.4 Reliability and key failure mechanisms. 12.5 Issues in packaging of microsystems. References. 13. Fabrication Examples of Smart Microsystems. 13.1 Introduction. 13.2 PVDF transducers. 13.3 SAW accelerometer. 13.4 Chemical and biosensors. 13.5 Polymeric fabrication of a microfluidic system. References. 14. Structural Health Monitoring Applications. 14.1 Introduction. 14.2 Structural health monitoring of composite wing-type structures using magnetostrictive sensors/actuators. 14.3 Assesment of damage severity and health monitoring using PZT sensors/actuators. 14.4 Actuation of DCB specimen under Mode-II dynamic loading. 14.5 Wireless MEMS-IDT microsensors for health monitoring of structures and systems. References. 15. Vibration and Noise-Control Applications. 15.1 Introduction. 15.2 Active vibration control in a thin-walled box beam. 15.3 Active noise control of structure-borne vibration and noise in a helicopter cabin. References. Index.

/pdf/smart-material-systems-and-mems-design-and-development-40ez82mtxy.pdf

Smart Material Systems and MEMS: Design and Development Methodologies

Micro Electro Mechanical Systems (MEMS) packaging is expensive and product and application specific. Single chip packages for IC's are only for some microsystems applicable. Cost efficient MEMS packaging focuses wafer level packaging (WLP). An identical trend is observed in IC packaging. Chip size packages (CSP) are fabricated by WLP. Future microelectronic system will be fabricated by wafer level assembly of multiple components on a base chip. System on package (SOP) techniques including 3D cubic integration will be used. For MEMS packaging a Modular MEMS system integration (MOMEMS) is proposed. Cubic integration by stacking of CSP packaged MEMS modules contribute to an economic realization of low volume microsystems.

H. Reichl

Papers

Overview and development trends in the field of MEMS packaging