Showing papers by "Haikal El Abed published in 2022"

Technical program committee

Abstract: Einar Aas, University of Trondheim, Norway Toru Adachi, NlT Telecommunications, Network Laboratory Group, Japan Mart Altmae, Synthesia AB, Sweden Kurt Antreich, Technical University of Munich, Germany Mary Bailey, Runcorn Research Corp., USA W. Benecke, University of Bremen, Germany G. Bergmann, TEMIC, Germany Gabriel Bischoff, Digital Equipment Corp., USA Ivo Bolsens, IMEC, Belgium Gaetano Borriello, University of Washington, Seattle, USA Paolo Camurati, Politecnico di Torino, Italy Herman Casier, Alcatel Mietec, Belgium . Tim Cheng, University of California, Santa Barbara, USA Luc Claesen, IMEC, Belgium Jose Luis Conesa, Telefonica I+D, Spain Olivier Coudert, Synopsys, Inc., USA Bernard Courtois, TIMA, Grenoble, France Carlos Delgado Kloos, ETSI Telecommunication, Spain Mario Diaz Nava, SGS-Thomson Microelectronics, France Rolf Drechsler, Albert-Ludwigs-University Freiburg, Germany Petru Eles, Linkoping University, Sweden Jose Epifianio da Franca, Instituto Superior Tecnico, Lisbon, Portugal Rolf Ernst, Technical University of Braunschweig, Germany Hans Eveking, Technical University of Darmstadt, Germany Joan Figueras, Universitat Politecnica de Catalunya, Spain J.O. Fischer-Binder, ANACAD, Germany Hans Fleurkens, Philips Research Laboratories, The Netherlands Gilles Foumeris, SGS-Thomson Microelectronics, France Norbert Fristacky, Slovak Technical University, Slovak Republic Hiroyuki Fujita, The University of Tokyo, Japan Hideo Fujiwara, Nara Institute of Science and Technology (NAIST), Japan Kaigham Gabriel, Advanced Research Projects Agency (ARPA), USA Georges Gielen, Catholic University of Leuven, Belgium Manfred Glesner, TH Darmstadt, Germany Roman Hermida, Universidad Complutense de Madrid, Spain Hiromi Hiraishi, Kyoto Sangyo University, Japan Fumiyasu Hirose, Fujitsu Laboratories, Ltd., Japan Jan Hlavicka, Czech Technical University, Czech Republic Jose Lius Huertas, Centro National de Microelectronica, Spain Daniel Ioan, ‘Politechnica’ University of Bucharest, Romania Keiji Ishikawa, N’IT LSI Laboratories, Japan Masaki Ito, Hitachi, Ltd., Japan Ahmed A. Jerraya, TIMA, Grenoble, France Jochen Jess, Eindhoven University of Technology, The Netherlands V. Kempe, AMS, Austria Shinji Kimura, Nara Institute of Science and, Technology (NAIST), Japan Polen Kission, TIMA, Grenoble, France Michael Koch, University of Restock, Germany Mario Kovac, University of Zagreb, Croatia Gunter Krampl, Siemens EZM GmbH, Germany Andrzej Krasniewski, Warsaw University of Tecnology, Poland