H
Hans-Christian Möhring
Researcher at Leibniz University of Hanover
Publications - 15
Citations - 203
Hans-Christian Möhring is an academic researcher from Leibniz University of Hanover. The author has contributed to research in topics: Machine tool & Machining. The author has an hindex of 5, co-authored 15 publications receiving 184 citations.
Papers
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Journal ArticleDOI
Process monitoring with sensory machine tool components
TL;DR: In this article, a sensing fixture and an adaptive sensory milling spindle are integrated for self-calibration and a detailed insight into the process dynamics can be observed from both sides of the process.
Journal ArticleDOI
Integrated autonomous monitoring of ball screw drives
TL;DR: In this paper, an integrated sensory ball screw double nut system is presented, which measures the pre-stress as a wear indicator by strain gauges or sensory thin layers, and the information is processed by integrated electronics and communicated wirelessly.
Journal ArticleDOI
Active error compensation in contour-controlled grinding
TL;DR: In this article, a new process chain for near-net-shape forged and immediately heat-treated crankshafts omits soft pre-machining by a direct grinding process.
Patent
Contactless detecting device for three-dimensional detection of object surface, has evaluation unit to combine three-dimensional image information with thermographic image data to form three-dimensional thermographic image information
TL;DR: In this paper, a light receiving camera unit and a thermographic camera unit were used to detect a surface of an object using light-image data and combining the three-dimensional image information with the thermographic image data to form 3D image information of the surface.
Journal ArticleDOI
Fast reacting maintenance of forming tools with a transportable machining unit
TL;DR: In this article, a transportable hybrid kinematics machining unit has been developed for repair processing of metal forming tools near the production line, which allows the description of geometric errors, compliance and thermal effects.