The invention provides a non-electrolyte tantalum electrolytic capacitor positive and negative electrode patch welding process. According to the process, a positive lead and a negative lead of the electrolytic capacitor are completely removed; and then the positive and negative patches are fixed on the positive and negative ends of the electrolytic capacitor through electrolytic capacitor plasma ball welding, electrolytic capacitor patch spot welding and electrolytic capacitor patch full welding, so that the non-electrolytic tantalum electrolytic capacitor with the positive and negative patchfixed structure is obtained. The fixed structure of the positive and negative patches is obtained by adopting the process disclosed by the invention, so that the contact area of the product and a circuit board is increased when the product is welded. The mechanical strength of the product in the use process is increased, and the use reliability of the product in the structure is ensured. Operationis convenient, the production efficiency can be greatly improved, and the product percent of pass is increased.

Non-electrolyte tantalum electrolytic capacitor positive and negative electrode patch welding process

Provided is a method of manufacturing a solid electrolytic capacitor that suppresses spreading up of a solution. The method includes forming a porous sintered body made of a valve metal and having an anode wire sticking out therefrom; forming an insulating layer made of a fluorine resin, so as to surround the anode wire; and forming a dielectric layer on the porous sintered body; forming a solid electrolyte layer on the dielectric layer, after forming the insulating layer. The process of forming the insulating layer includes melting granular particles made of a fluorine resin.

Sold electrolytic capacitor, and method of manufacturing the same

The invention discloses a lead-out method for a lead-out wire of a tantalum electrolytic capacitor of a full tantalum shell and a capacitor. The capacitor is a monolithic capacitor; the lead-out method for the capacitor is that: nickel sheets or nickel-plated copper sheets are led out of both positive and negative electrodes; the sheets are one positive nickel or nickel-plated copper lead-out sheet and one negative nickel or nickel-plated copper lead-out sheet respectively; the end heads of the positive nickel or nickel-plated copper lead-out sheet and the negative nickel or nickel-plated copper lead-out sheet are provided with wiring holes; the lead-out sheets made of the positive nickel or nickel-plated copper lead-out sheet and the negative nickel or nickel-plated copper lead-out sheetare connected with other electronic element devices with wires; and the positive nickel or nickel-plated copper lead-out sheet and the negative nickel or nickel-plated copper lead-out sheet serving as the capacitor lead-out sheets are welded to the capacitor by laser welding respectively, and the whole body is used as the lead-out device of the capacity of the capacitor.

Lead-out method for lead-out wire of tantalum electrolytic capacitor of full tantalum shell and capacitor

The invention relates to a metallic packaging structurized chip-type tantalum capacitor and a packaging method thereof With the adoption of a metallic packaging structure, a layer of bonding conductive glue wraps outside a tantalum chip, and then a layer of metal shell wraps outside the bonding conductive glue; and meanwhile, one head of the tantalum chip is connected with a tantalum filament, and the tantalum filament is led out of the metal shell through a tantalum filament leading-out line to form the metallic packaging structurized chip-type tantalum capacitor The tantalum filament and the tantalum filament leading-out line are connected together by welding, a welding point of the tantalum filament and the tantalum filament leading-out line is arranged on the inner surface of the metal shell, an insulation block sleeves outside the welding point of the tantalum filament and the tantalum filament leading-out line, the bonding conductive glue wraps between the insulation block and the tantalum chip and also wraps outside the insulation block, and thus, the spaces among the tantalum chip, the tantalum filament, the tantalum filament leading-out line and the shell are relatively fixed

Metallic packaging structurized chip-type tantalum capacitor and packaging method thereof

The invention discloses a surface-mounting solid tantalum capacitor without a lead frame The surface-mounting solid tantalum capacitor comprises a capacitor body, a tantalum core a positive electrodelead and a negative electrode lead are arranged in the capacitor body, and the tantalum core is packaged by epoxy resin outside the capacitor, and the positive electrode lead and the negative electrode lead are led out from the bottom of the capacitor body respectively A form without lead frame is adopted, so that the positive and negative leads of a tantalum capacitor are packaged downwards, the transverse size is reduced, the needed printed circuit board space is smaller, and the development of the small-sized terminal equipment is facilitated

Surface-mounting solid tantalum capacitor without lead frame

The invention relates to a solid Ta electrolytic capacitor and a preparation method thereof, comprising a flat cuboid capacitor body which consists of a Ta core, an insulator and a metal shell, and a flat cathode dual-head leading wire and a flat anode dual-head leading wire which are arranged in a C-shape and respectively led out of the anode and cathode of the two ends of the body; in order to prepare the capacitor, firstly, the Ta core in flat cuboid shape is prepared; the C-shaped flat cathode dual-head leading wire and the anode dual-head leading wire are assembled with the Ta core; subsequently, resin is poured so as to form the capacitor by natural solidification. The electrolytic capacitor adopting the structure reduces the surface contact resistance of the product and has obviouseffect on reducing the high frequency ESR value of the product and improving the high frequency characteristic of the product as the capacitor body structure is changed into flat cuboid and the surface area of a Ta block is increased; after two ends of the leading wire are bent to parallel flat dual-head leading wire, most of the generated inductance can be counteracted, and the frequency range of the inductance appearing in the electronic circuit is delayed.

Solid tantalum electrolytic capacitor and manufacturing method thereof

The utility model relates to a solid tantalum electrolytic capacitor, which comprises a capacitor body that is composed of tantalum core assembly, an insulator, and a metal housing, and an anode lead wire and a cathode lead wire respectively elicited from the anode and the cathode of two ends of the capacitor body, wherein the capacitor body is a flat cuboid, the lead wires are bent at two ends and the bent two ends are parallel each other to form horizontal U-shaped flat double lead wires. By adopting the above structural tantalum electrolytic capacitor, the capacitor body is modified to be flat cuboid, so as to increase surface area of tantalum block, reduce surface contact resistance of product, and have obvious effects on reducing product high frequency ESR value and improving product high frequency property, after the two ends of the lead wires are bent to be parallel flat double lead wires, most generated inductances can be counteracted each other, the frequency range of inductive reactance occurred in the electronic circuitry is prolonged.

A solid tantalum electro-analysis capacitor

The utility model discloses a liquid tantalum electroanalysis capacitor, and the basic structure comprises a shell, a tantalum core, an insulator, a sealed solder ball, an anode leading-out wire, a cathode leading-out wire and a dion contract bushing, etc., wherein, the anode leading-out wire and the cathode leading-out wire are respectively sleeved with a lamellar anode base and a lamellar cathode base. Polyfluortetraethylene gaskets are arranged to separate the end parts of both poles and the bases. The end parts of both poles of the capacitor and the polyfluortetraethylene gaskets, as well as the polyfluortetraethylene gaskets and the bases are respectively stuck and fixed by using silicon rubber. The liquid tantalum electroanalysis capacitor has small installing dimension, convenient installation, firm fixation and wider application.

Hao Kong

Papers

Solid tantalum electrolytic capacitor and manufacturing method thereof

A solid tantalum electro-analysis capacitor

Liquid tantalum electrolytic capacitor