A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.

Laminated electronic component and method for manufacturing the same

We have investigated a series of compositions in the pseudo-ternary lead-free alloy system Na1/2Bi1/2TiO3-BaTiO3-BiFeO3 with regard to its energy storage density and discharge efficiency. A composition 0.4(Na0.5Bi0.5TiO3)-0.225BaTiO(3)-0.375BiFeO(3) of this series was identified to give the best energy density and discharge efficiency. While conventional sintering gave energy density of 0.77 J/cm(3) and discharge efficiency of 67%, we achieved a remarkable increase in energy storage density (similar to 1.4 J/cm3) and discharge efficiency (similar to 90%) by using spark plasma sintering of this composition. Our results suggest that this alloy system can be a potential lead-free candidate for high electric energy storage and discharge efficiency.(C) 2017 Elsevier Ltd. All rights reserved.

A complex lead-free (Na, Bi, Ba)(Ti, Fe)O-3 single phase perovskite ceramic with a high energy-density and high discharge-efficiency for solid state capacitor applications

An apparatus for creating multi-layer embedded ceramic capacitors in low-temperature co-fired ceramic (LTCC) substrates. In order to create multiple layers of electrodes, the individual electrode layers must be connected electrically. According to the present invention, a multi-layer capacitor is formed on a first ceramic tape layer. A second tape layer having an opening is placed on top of the first layer. The opening in the second layer is formed such that exposed vias are present on at least two sides of the opening to electrically connect to the electrodes. When the tape layers are pressed and fired, the exposed vias and electrodes form common electrical connections. A third layer having a terminal via may be placed on top of the second layer.

Embedded multi-layer ceramic capacitor in a low-temperature con-fired ceramic (LTCC) substrate

A ceramic electronic component includes a ceramic body, inner electrodes, a glass coating layer, and outer electrodes. The glass coating layer extends from an exposed portion of one of the inner electrodes at a first end surface to a first principal surface. The outer electrodes are each constituted by a plating film disposed directly above the glass coating layer. The glass coating layer includes a glass medium and metal powder particles that define conductive paths. The metal powder particles have an elongated or substantially elongated shape and are dispersed in the glass medium. The dimension of a portion of the glass coating layer located on the first principal surface in the length direction, is larger than that of a portion of the glass coating layer located on the first end surface in the thickness direction.

Ceramic electronic component

A multilayer ceramic substrate with an interlayered capacitor has a large electrostatic capacity and a high flexural strength, such as 1,500 Kg/cm 2 or more, and yet is manufactured at a relatively low firing or sintering temperature. A first ceramic body includes a plurality of laminated first ceramic sheets with a high dielectric constant and with a plurality of internal electrodes sandwiching the respective first ceramic sheets to form capacitors therebetween. A second ceramic body is laminated over one side of the first ceramic body and has a plurality of laminated second ceramic sheets with a low dielectric constant. A plurality of first wiring layers are sandwiched between the second ceramic sheets. A third ceramic body is laminated over the other side of the first ceramic body and has a plurality of laminated third ceramic sheets formed of the same ceramic material that is used to make the second ceramic sheets. The second and third ceramic bodies are thicker than the first ceramic body. A second embodiment of the invention is a hybrid ceramic structure made of glass-ceramic insulator layers sandwiching at least one dielectric layer with interposed circuit patterns formed thereon.

Multilayer ceramic substrate with interlayered capacitor

A multi-layer ceramic capacitor is characterized by a ceramic composition including barium titanate and lithium fluoride as essential ingredients resulting in the capability of sintering the composition at temperatures below 1100° C. As a consequence, the electrodes for the capacitor can be formulated from pure silver or a silver palladium composition in which the major component is silver thereby decreasing the expense of such capacitors as compared to those requiring platinum, gold, or mixtures of these precious metals and/or similar precious metals in making up the electrodes.

Harlan Urie Anderson

Papers

Low temperature fired ceramic capacitors