ext to chip technology, electronic packaging is the key to the implementation of high-performance systems, now and in the future. This article takes a systematic look at the new trends and paradigm shifts in electronic packaging that will dominate the field for the next few years. APL’s current status in modern electronic packaging is presented, along with indications of how APL is responding to the rapidly changing packaging environment.

APL's Packaging Future: The Next Few Years

A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protection. Each packaging level reflects a trade-off among many interrelated factors including design requirements, economics, and manufacturing infrastructure.

Modern Electronic Packaging Technology

The functional feasibility of a variety of prototypical SiC electronic and power devices structures have recently been demonstrated. Interest in high temperature SiC devices is motivated in part by the contention of ‘‘greatly’’ simplified passive cooling’’ of such devices. Allowing junction temperatures to increase to the 600K (∼300°C) plus regime would permit operation of many electronic devices in environments not compatable with the 400K (100–125°C) reliability imposed temperature limits of silicon devices. However, the current density and forward voltage drop characteristics of SiC power switching devices will likely be similar to present MCT devices, requiring dissipation of heat fluxes in 1 Mw/m2 (100w/cm2) regime. This combination high heat flux/high temperature introduces several novel issues related to thermal management of such devices.

Harry K. Charles

Papers

Materials in electronic packaging at APL