An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

A power semiconductor device includes trenches disposed in a first base layer of a first conductivity type at intervals to partition main and dummy cells, at a position remote from a collector layer of a second conductivity type. In the main cell, a second base layer of the second conductivity type, and an emitter layer of the first conductivity type are disposed. In the dummy cell, a buffer layer of the second conductivity type is disposed. A gate electrode is disposed, through a gate insulating film, in a trench adjacent to the main cell. A buffer resistor having an infinitely large resistance value is inserted between the buffer layer and emitter electrode. The dummy cell is provided with an inhibiting structure to reduce carriers of the second conductivity type to flow to and accumulate in the buffer layer from the collector layer.

Power semiconductor device

An object is to provide a method for manufacturing a semiconductor device, in which the number of photolithography steps can be reduced, the manufacturing process can be simplified, and manufacturing can be performed with high yield at low cost A method for manufacturing a semiconductor device includes the following steps: forming a semiconductor film; irradiating a laser beam by passing the laser beam through a photomask including a shield for shielding the laser beam; subliming a region which has been irradiated with the laser beam through a region in which the shield is not formed in the photomask in the semiconductor film; forming an island-shaped semiconductor film in such a way that a region which is not irradiated with the laser beam is not sublimed because it is a region in which the shield is formed in the photomask; forming a first electrode which is one of a source electrode and a drain electrode and a second electrode which is the other one of the source electrode and the drain electrode; forming a gate insulating film; and forming a gate electrode over the gate insulating film

Method for Manufacturing Semiconductor Device

A system for securing an integrated circuit chip used for biometric sensors, or other electronic devices, by utilizing a physically unclonable function (PUF) circuit. These PUF functions are in turn used to generate security words and keys, such as an RSA public or private key. Such a system can be used to protect biometric security sensors and IC chips, such as fingerprint sensors and sensor driver chips, from attack or spoofing. The system may also be used in an efficient method to produce unique device set-up or power-up authentication security keys. These keys can be generated on a low frequency basis, and then frequently reused for later security verification purposes. In operation, the stored keys can be used to efficiently authenticate the device without the need to frequently run burdensome security key generation processes each time, while maintaining good device security.

Method and system for electronically securing an electronic device using physically unclonable functions

A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

Solid element device and method for manufacturing the same

A capacitive fingerprint sensor includes a polymeric protective coating defining a sensing surface and having conductive particles suspended therein. The conductive particles act as parallel strings of series capacitors to couple the capacitance the fingerprint-bearing skin of a user's finger applied to the sensing surface to capacitive sensing elements beneath the protective coating. The polymeric material of the coating is durable and scratch resistant. The conductive particles enable use of a protective coating of 10 to 20 microns in thickness while providing a high degree of sensitivity and image resolution.

Capacitive fingerprint sensor with protective coating containing a conductive suspension

An integrated circuit (IC) device comprising: 1) an integrated circuit (IC) die having a first surface, a second surface opposite the first surface, and sidewalls extending between the first surface and the second surface; 2) an integrated circuit (IC) package for supporting the IC die, wherein the IC package is attached to at least one of the sidewalls of the IC die such that at least a portion of the IC die first surface and at least a portion of the IC die second surface are exposed; and 3) at least one auxiliary component attached to at least one of the exposed portion of the IC die first surface and the exposed portion of the IC die second surface.

Integrated circuit package with exposed die surfaces and auxiliary attachment

A molded integrated circuit package system of the type suitable for surface mounting is disclosed. The system includes a chip package having leads along its sides that are of the surface-mountable type, and having a plurality of connectors at its ends. A module is provided which contains components that are sensitive to solder temperatures or the chemicals used in the soldering process; examples of such components include batteries and quartz crystal resonators. The module has connectors extending therefrom that mate with the connectors on the chip package, such that the module may be removably connected to the chip package after the surface mounting of the chip package to a circuit board. Mechanical connection may be provided by snap members extending from the module which engage surfaces of the chip package when mounted thereto. Lockout tabs are provided on the chip package and the module to prevent improper mounting and electrical connection.

Surface mountable integrated circuit package with detachable module

A molded integrated circuit package system of the type suitable for surface mounting is disclosed The system includes a chip package having leads along its sides that are of the surface-mountable type, and having a plurality of connectors at its ends A module is provided which contains components that are sensitive to solder temperatures or the chemicals used in the soldering process; examples of such components include batteries and quartz crystal resonators The components may be disposed directly over the chip package or, in order to reduce the height of the package system, one or both of the components may be disposed outside of the outline of the chip package The module has connectors extending therefrom that mate with the connectors on the chip package, such that the module may be removably connected to the chip package after the surface mounting of the chip package to a circuit board Mechanical connection may be provided by snap members extending from the module which engage surfaces of the chip package when mounted thereto Lockout tabs are provided on the chip package and the module to prevent improper mounting and electrical connection

Surface mountable integrated circuit package with low-profile detachable module

A method for removing heat from an active area of an integrated circuit device is provided The method includes applying a separator to the active area of the integrated circuit device A thermally conductive element is coupled to the active area of the integrated circuit device outwardly of the separator

Harry Michael Siegel

Papers

Capacitive fingerprint sensor with protective coating containing a conductive suspension

Integrated circuit package with exposed die surfaces and auxiliary attachment

Surface mountable integrated circuit package with detachable module

Surface mountable integrated circuit package with low-profile detachable module

Method and system for removing heat from an active area of an integrated circuit device