A heat curable one package polyurethane resin composition adaptable to use for automotive seam sealing, particularly under high solids acrylic enamel paints, said composition comprising an isocyanate terminated polyurethane prepolymer having pendant epoxy groups along the polymer chain and the isocyanate groups of which are blocked by reaction with an oxime, and a curing agent having at least two active hydrogen atoms per molecule, such as a polyol, a polyamine, or a blocked polyamine.

Heat curable one package polyurethane resin composition

A N-substituted piperazine or N-substituted homopiperazine adduct with a polyepoxide is used as a co-curing agent in epoxy resin systems containing a polyepoxide and a known curing agent such as dicyandiamide, a carboxylic acid anhydride, or a dihydrazide. The preferred adducts have a ratio of epoxy groups to secondary amino groups of between 1.2:1 and 3:1. The preferred polyepoxides are polyglycidyl ethers of 4,4'-isopropylidenediphenol (bisphenol A). Suitable adducts are prepared from N-methyl-, N-(2-hydroxyethyl)-, N-octyl-, N-phenyl- and N-benzyl piperazine and N-methyl homopiperazine.

Co-curing agents for epoxy resins

The invention provides a polymer (a) having a polymer backbone having appended thereto at least one carbamate functional group, the polymer represented by randomly repeating units according to the formula: R 1 represents H or CH 3 , R 2 represents H, alkyl, or cycloalkyl, L represents a divalent linking group, A represents repeat units comprising at least one repeat unit having a pendant cationic salting group, x represents 10 to 90 weight %, and y represents 90 to 10 weight %. The invention further provides a cathodic electrocoat coating composition comprising an aqueous dispersion of a polymer (a) and (b) a compound having a plurality of functional groups that are reactive with said carbamate groups, wherein the repeat units A of polymer (a) having a pendant cationic salting group are salted with an acid.

Cathodic electrocoat having a carbamate functional resin

A semiconductor device sealed in a resin composition, wherein the resin composition contains the prescribed percentages of inorganic fillers having extremely small amounts of impurities, epoxy resin having an epoxy equivalent of 250 or less and a softening point of 120° C. or less, hardening agent, hardening promoter and low melting paraffins.

Resin-sealed semiconductor device

The invention provides a cathodic electrocoat coating composition having (A) a polymer comprising at least one primary carbamate group and at least one cationic salting site, (B) a curing agent having groups that are reactive with said functional groups on (A), and (C) a reactive additive comprising at least one compound having a molecular weight of from 131 to 2000 and comprising at least one primary carbamate group and at least one alkyl group selected from the group consisting of branched alkyl groups of from 5 to 30 carbons, straight chain alkyl groups of more than 10 carbons, and mixtures thereof, wherein one or both of (A) and (B) comprise groups that are reactive with the primary carbamate group of (C).

Cathodic electrocoat having a carbamate functional resin and a carbamate functional reactive additive

THE REACTION PRODUCTS OF APPROXIMATELY EQUIMOLECULAR PROPORTIONS OF AN ACID ANHYDRIDE, SUCH AS PHTHALIC ANHYDRIDE, AND A POLYAMINE, SUCH AS DIETHYLENETRIAMINE, ARE LATENE HARDENERS FOR EPOXY RESINS HAVING MORE THAN ONE 1,2-EPOXY GROUPS PER MOLECULE AND, WHEN COMBINED WITH AN EPOXY RESIN, PROVIDE SYSTEMS WHICH ARE STABLE FOR LONG PERIODS WHEN STORES AT AMBIENT OR MODERATELY ELEVATED TEMPERATURES WHILE PROVIDING ON CURING FOR RELATIVELY SHORT PERIODS AT ELEVATED TEMPERATURES, ON THE ORDER OF 100150*C., HARDENED PRODUCTS OF GOOD PROPERTIES.

Henry Thomas Belekicki

Papers

Products of acid anhydrides and polyamines used as latent hardeners for epoxy resins