Provided is curable resin composition which gives a cured article excellent in chemical resistance, dielectric properties, low water-absorption, heat resistance, flame retardance, and mechanical properties and which is usable in applications such as dielectric materials, insulating materials, heat-resistant materials, and structural materials. The curable resin composition includes a component (A) which is a polyphenylene ether oligomer having a number-average molecular weight of 700 to 4,000 and having a vinyl group at both end and a component (B) which is a solvent-soluble polyfunctional vinylaromatic copolymer which has structural units derived from monomers including a divinylaromatic compound (a) and an ethylvinylaromatic compound (b) and in which the content of repeating units derived from the divinylaromatic compound (a) is 20 mol % or higher, the ratio of the amount (wt. %) of the component (A) to that (wt. %) of the component (B) being (20 to 98):(2 to 80). The composition can further contain a layered silicate, a halogenated flame retardant, etc.

Curable resin composition

An object of the present invention is to provide a polyphenylene ether resin composition which, while retaining excellent dielectric properties, is also endowed with excellent properties such as heat resistance, adhesion and Tg. The polyphenylene ether resin composition includes (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and (B) a crosslinking agent having a carbon-carbon unsaturated double bond. The crosslinking agent serving as component (B) includes from 50 to 100 mass % of (B-1) diviny)benzene and (B-2) polybutadiene. Components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A) : (B), of from 65:35 to 95:5. Components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1) : (B-2), of from 1:100 to 1.5:1.

Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring board

Provided is a process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process includes the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer; and a resin varnish, a prepreg, and a metal-clad laminate provided using the same.

Process for producing resin varnish containing semi-ipn composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate

A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.

Resin composition and uses of the same

A varnish composition for producing an electrically insulative thermoset coating is disclosed. The varnish composition comprises a functionalized poly(phenylene ether), an unsaturated polyester, and/or a vinylester resin. The varnish composition further comprises a reactive liquid monomer and a block copolymer comprising a poly(olefin) block, or a poly(diolefin) block, and at least one terminal poly(alkenyl aromatic) block comprising repeat units derived from an alkenyl aromatic monomer. When cured, the polymers and reactive liquid monomer forms an electrically insulative thermoset that provides superior crack resistance.

Varnish compositions for electrical insulation and method of using the same

PURPOSE: To provide the subject resin composition composed of a polyphenylene ether resin containing unsaturated groups and a curable compound, capable of producing a cured material excellent in chemical resistance, dielectric properties and heat resistance and suitable for a dielectric material, an insulating material, etc., in the fields of electric-electronic industries, etc. CONSTITUTION: With (A) 98-20wt.% polyphenylene ether resin containing unsaturated groups, (B) 2-80wt.% on or more compounds selected from a group of compounds composed of diallyl phthalate, divinyl benzene, polyfunctional (meth) acryloyl compounds, polyfunctional maleimides, polyfunctional cyanurates, polyfunctional isocyanates and unsaturated polyesters and/or a prepolymer are blended. The above-mentioned composition is excellently used in a form of a film and a cured composite material is obtained from the above-mentioned composition and a base material (e.g. roving cloth or cloth). In addition, a laminated material (plate) can be obtained by combining the resultant cured composite material with a metal foil and/or a metal base. COPYRIGHT: (C)1992,JPO&Japio

Curable resin composition and curable composite material

PROBLEM TO BE SOLVED: To provide a method for producing a laminated board made of a polyphenylene ether resin composition in which the warpage and dimensional change of the board are eliminated. SOLUTION: A base material impregnated with a polyphenylene ether resin composition and metal foil are laminated in layer composition corresponding a purpose, and a laminated board is manufactured in conditions of temperature: 130-220°C, pressure: 1-50 kg/cm2, time: 10-480 min. The laminated board is further heat-treated in conditions of temperature: 120-220°C, pressure: 0.01-50 kg/cm2, time: 5-480 min. COPYRIGHT: (C)2001,JPO

Production of laminated board

耐熱性および優れた誘電特性を有するプリント配線板材料として熱硬化型PPE樹脂S4100を開発した。S4100とガラスクロスを用いて銅張積層板を作成し特性を調べたところ, S4100積層板は2GHzにおける比誘電率が3.36, 誘電正接が0.004と良好な高周波特性を有し, かつガラス転移温度が200℃とポリイミドに次ぐ高い耐熱性を合わせ持つ材料であることがわかった。材料の絶縁信頼性の尺度の1つとしてGHz領域の誘電特性の安定性が重要であると考え, S4100積層板の誘電率, 誘電正接の温度依存性と加湿条件下での特性変化を調べ, FR-4積層板およびフッ素樹脂積層板と比較した。S4100積層板の誘電率, 誘電正接の温度依存性は小さく, 代表的な低誘電率低損失材料であるフッ素樹脂積層板以上の安定性を有していた。プレッシャークッカーによる加湿に対する誘電特性の安定性の評価では, 吸水率が0.2%とFR-4積層板の0.9%より小さいため, 誘電率, 誘電正接の変化が小さかった。この加湿条件ではFR-4積層板にはんだ耐熱試験でふくれが発生したが, S4100積層板には問題は発生しなかった。伝送損失測定により, 0.8～4GHzの周波数領域ではS4100積層板がフッ素樹脂積層板と同等の低伝送損失であることがわかった。高速デジタル回路板や高周波通信機器の基板などに有用な材料であることが確かめられた。

Stability of Dielectric Characteristics of Thermosetting PPE Resin Laminate

良好な誘電特性と耐熱性を兼ね備えた多層配線板材料として, 熱硬化型ポリフェニレンエーテル (PPE) 樹脂〔S2100〕を開発した。Eガラスクロスを使用したS2100プリプレグは, パウダーフリーで樹脂流れ性が良好であり, 両面銅張積層板および多層配線板が問題なく成形できた。S2100積層板は1MHzにおける誘電率が3.5, 誘電正接が0.003, ガラス転移温度210℃であり, ショアデュロメータ硬さおよび銅箔引きはがし強さが200℃でも低下しないため, 低誘電率, 低伝送損失, かつワイヤボンディング耐性が求められる最近のLSIパッケージ材料に適する。S2100積層板はドリル加工性が良好で, ドリル磨耗量, スルーホール内壁粗さ共にFR-4より小さかった。S2100の誘電率と誘電正接の温度依存性を1GHzにおいて測定したところ, -20℃～80℃の温度範囲ではそれぞれ3.3, および0.005の一定値であった。GHz領域の伝送損失を測定したところ, S2100は7GHz以下の領域において0.1dB/cm以下の低伝送損失性を有することがわかった。プレッシャークッカーによる1000時間の超加速信頼性試験では, S2100積層板が0.4%という低い吸湿量であるため, 誘電特性が安定であるのみならずはんだ耐熱性でもFR-4より優れていることが示された。銅イオンマイグレーション試験では, S2100積層板はFR-4より常に1桁高い絶縁抵抗値を保った。多層配線板を作成し温湿度サイクル試験, はんだ耐熱性試験, オイル浸せき熱衝撃試験, および冷熱衝撃試験を行ったところ, S2100はいずれの試験においてもまったく問題を生じなかった。

The Evaluation of Thermosetting Polyphenylene Ether for High Frequency Multilayer Printed Circuit Boards

きわめて優れた耐熱性と誘電特性を兼ね備えた超多層板材料として, 熱硬化型ポリフェニレンエーテル (PPE) 樹脂 [S3100] を開発した。Eガラスクロスを使用したS3100プリプレグは, パウダーフリーで樹脂流れ性が良好であり, 多層板がボイド等の問題なく成形できた (70μm銅箔使用) 。S3100積層板は1MHzにおける誘電率が3.6, 誘電正接が0.002, ガラス転移温度が240℃であり, 熱膨張率は小さく, ショアデュロメータ硬さおよび銅箔引きはがし強度が200℃でも低下しなかった。S3100銅張積層板は優れた誘電特性を持ちながら加工性の良いEガラスを用いているために, Dガラスを用いた基板と比較してドリル磨耗度, スルーホール内壁粗さが圧倒的に小さく, ドリル加工性が優れていた。S3100の誘電率と誘電正接 (1GHz) は-20℃～80℃でまったく変動がなく, 室温付近のガラス転移点による急激な誘電特性の変化が避けられないPTFEとは対照的であった。GHz領域の伝送損失を測定したところ, S3100は12GHz以下の領域において0.1dB以下の低伝送損失性を有することがわかった。24層までの多層配線板を試作し温湿度サイクル試験, はんだ耐熱試験, オイル浸せき熱衝撃試験, および冷熱衝撃試験を行ったところ, S3100はいずれの試験においてもまったく問題を生じなかった。70μm厚みの銅箔を用いた場合にもパターン埋め込み性試験および冷熱衝撃試験で問題はなく, S3100は70μm厚みの銅箔の電源層としての使用にも適することがわかった。

Hidehisa Yokoyama

Papers

Curable resin composition and curable composite material

Production of laminated board

Stability of Dielectric Characteristics of Thermosetting PPE Resin Laminate

The Evaluation of Thermosetting Polyphenylene Ether for High Frequency Multilayer Printed Circuit Boards

Thermosetting Polyphenylene Ether for Multilayer Printed Circuit Boards