An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

Provided is a field-effect transistor including an active layer and a gate insulating film, wherein the active layer includes an amorphous oxide layer containing an amorphous region and a crystalline region, and the crystalline region is in the vicinity of or in contact with an interface between the amorphous oxide layer and the gate insulating film

Field-effect transistor

An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

Semiconductor device and display device

Enhancement mode, field effect transistors wherein at least a portion of the transistor structure may be substantially transparent. One variant of the transistor includes a channel layer comprising a substantially insulating, substantially transparent, material selected from ZnO, Sn02, or In203. A gate insulator layer comprising a substantially transparent material is located adjacent to the channel layer so as to define a channel layer/gate insulator layer interface. A second variant of the transistor includes a channel layer comprising a substantially transparent material selected from substantially insulating ZnO, Sn02or In2O3, the substantially insulating ZnO, Sn02, or In203 being produced by annealing. Devices that include the transistors and methods for making the transistors are also disclosed.

Transistor structures and methods for making the same

A thin film transistor (1) wherein a gate electrode (3) is formed on an insulative substrate (2), a gate insulating layer (4) is formed on the gate electrode (3), a semiconductor layer (5) is formed on the gate insulating layer (4), a source electrode (6) and a drain electrode (7) are formed on the semiconductor layer (5), and a protective layer (8) covering them are formed. The semiconductor layer (5) is isolated from the atmosphere. The semiconductor layer (5) (active layer) is formed of a ZnO polycrystalline semiconductor doped with, for example, a group V element. Since the surface state of the ZnO semiconductor is reduced thanks to the protective layer (8) and inward expansion of the depletion layer is prevented, the ZnO semiconductor is of an n-type showing its intrinsic resistance value and contains excessive free electrons. The added element acts as acceptor impurities in the ZnO semiconductor, decreasing the excessive electrons. Thus the gate voltage to eliminate the excessive free electrons lowers, thereby making the threshold voltage around 0 V. A semiconductor device using a zinc oxide for an active layer and having a protective layer for isolating the active layer from the atmosphere can be actually used.

Semiconductor device, its manufacturing method, and electronic device

PURPOSE: To obtain an excellent PN junction by doping controlled metal oxide semiconductor with impurities, by controlling defects by introducing hydrogen or the like in the defects due to the excessive oxygen in a part of metal oxide semiconductor of copper suboxide or the like, and controlling the carrier density and the conductivity type. CONSTITUTION: A metal oxide semiconductor 25 is metal semiconductor obtained by oxidizing metal films 24, 24'. An insulating protective film is formed on the surfaces of an insulating film 26 and the metal oxide semiconductor 25. By leading out electrodes connected with source drain electrodes 24, 24', a transistor having a gate electrode 22 is formed. The carrier density and the conductivity type are controlled by eliminating oxygen defects. The P-type conductivity or the N-type conductivity, and the resistivity can be controlled by impurity doping. In these cases, ion implantation method or the like can be applied. Thereby a thin film transistor of high mobility can be formed in a large area by low temperature treatment.

Metal oxide semiconductor device forming a pn junction with a thin film transistor of metal oxide semiconductor of copper suboxide and manufacture thereof

PURPOSE: To make it possible to produce a silicon thin film having a high mobility and an extremely thin film thickness at a low temperature by providing a low pressure in a reactor, increasing a proportion of other material gas to a silicon compound gas, and raising the temperature of catalyst body higher than the silicon melting temperature by increasing the electric power supplied to the catalyst. CONSTITUTION: A raw material gas contains a silicon compound gas, for example, silane and other material gas such as hydrogen for instance. Pressure condition for the reactor 1 is a low pressure such as 0.05Torr., and the mixing ratio of the other material gas to the silicon compound gas is higher than the conventional ratio used. Also, the condition of electric power to be supplied to the catalyst body can be expressed by the temperature of the catalyst 3 equal to the silicon melting temperature (higher than 1,450°C, or higher than 1,700°C is more desired). When the conditions stated above are respectively fulfilled, a polycrystal silicon thin film with a film thickness of less than 0.1μm can be formed at a low temperature. COPYRIGHT: (C)1996,JPO

Hideki Matsumura

Papers

Metal oxide semiconductor device forming a pn junction with a thin film transistor of metal oxide semiconductor of copper suboxide and manufacture thereof

Silicon thin film forming method by catalyst cvd method, manufacture of thin film transistor, and thin film transistor