A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular figuration complementary to the configuration of the flanges 1b.

Wire wound electronic component and method of manufacturing the same

A high current, low profile inductor includes a wire coil having an inter coil end and an outer coil end. A magnetic material completely surrounds the wire coil to form an inductor body. First and second leads connected to the inner coil end and the outer coil end respectively extend through the magnetic material to the exterior of the inductor body. The method of operation involves pressure molding the magnetic material around the wire coil.

High current, low profile inductor

A low profile magnetic component with planar coil portion, polymer-based supporting structure and methods of fabrication.

Low profile layered coil and cores for magnetic components

A laminated coil component includes an element assembly formed by laminating a plurality of insulation layers and a coil unit formed inside the element assembly by a plurality of coil conductors. The element assembly includes a coil unit arrangement layer which has the coil unit arranged therein, and at least a pair of shape retention layers which is provided to have the coil unit arrangement layer interposed therebetween to retain a shape of the coil unit arrangement layer. The shape retention layer is made from glass-ceramic containing SrO, and a softening point of the coil unit arrangement layer is lower than a softening point or a melting point of the shape retention layer.

Laminated coil component

PURPOSE: To obtain an annular or rod-like inductor by a method wherein a sintered magnetic material, consisting of soft magnetic material and having a groove provided in advance for formation of a winding without using a winding machine for formation of the annular or rod-like inductor around the magnetic path of an annular or rod-like magnetic material, is formed and a conductor is formed in the groove. CONSTITUTION: After kneading the mixture, consisting of oxide magnetic powder having a high relative permeability and the binder mainly composed of an organic high molecular compound, the mixture is injection-molded in a mold in which grooves 2, a terminal point 3 and a lead hole 4 are formed. A metal layer conductor, having excellent electricity conducting characteristics, is filled in the groove of a degreased and sintered annular soft magnetic body 1, and the mixture of an annular inductor or oxide magnetic powder and an organic high molecular compound are kneaded. The mixture is semicylindrically extrusion-molded, a groove is provided around it, a good electric conductive material is filled in the groove, and a rod-like inductor is formed. COPYRIGHT: (C)1994,JPO

Inductor and manufacture thereof

A method of manufacturing a chip coil, including a coil element which includes a magnetic core, a winding wire, and internal terminal electrodes, a fired mass of magnetic material surrounding and encapsulating the coil element, and external terminal electrodes electrically connected to the internal terminal electrodes. The winding wire is coated with a heat-resistive electrically insulating film and is wound around the magnetic core. The internal terminal electrodes are electrically connected to opposite ends of the winding wire and are exposed to the exterior of the mass at opposite ends of the core where they are electrically connected to the external terminal electrodes.

Method of manufacturing a chip coil

PURPOSE:To obtain an inductor with a simple process, good mass productivity, easy adjustment of inductance and a few occurrence of trouble at the timing of dipping solder by a method wherein a long winding inductor bar coated a magnetic substance on the circumference of the bar is cut. CONSTITUTION:AgPd alloy wire 7 coated by magnetic substance or coating containing ceramic is wound on a magnetic substance bar 6. At rough winding sections 81 the conductor is bared and AgPd alloy paste 9 is applied on the rough winding sections 81 and dried. Magnetic substance paste is coated on the circumference of the winding magnetic substance bar and is burned for two hours at 900 deg.C and the obtained long inductor bar 10 is cut at the center of the rough winding sections. AgPd paste is applied to the AgPd wires of the obtained inductor element pieces 11 both sectional faces exposed internal electrodes 12 for burning and external electrodes are formed. This method is a winding system. Therefore, arbitrary inductance is obtained without any trouble on process and high inductance is possible.

Manufacture of inductor

PURPOSE:To simplify a manufacturing process by merely stacking up slitted green sheets of magnetic material by a method wherein a slit is provided in every coil-forming pattern at a part where electroconductive patterns are to overlap for connection via the slit and another part is arranged to meet a corresponding part in the upper layer. CONSTITUTION:A magnetic material 11 is printed on a polyester film, whereon an electroconductive pattern 12 is printed with a terminal S' at an edge of the magnetic material 11. Next, overlapping the magnetic material 11 and the electroconductive pattern 12, a magnetic material 14 is printed provided with a slit 13. The slit 13 is so arranged that it is located to meet the end P' of the electroconductive pattern 12 and an electroconductive pattern 15 that is a turn of a coil lacking a small part is printed on the slit 13 and the magnetic material 14. This results in electric connection established between electroconductive patterns 12 and 15 because of their lapping on the slit 13. Next, a magnetic material 17 is printed with a slit 16 meeting the end Q' of the electroconductive pattern 15, and an electroconductive pattern 18 is printed starting at a slit 16. Electric connection is established between the patterns 15 and 18 because of their lapping on the slit 16.

Manufacture of chip inductor

An inductance part comprises a pillar-like base (21) made of a magnetic material, a conductor layer (24) covering the end and side faces of the base, a coil portion (27) having grooves (25) and linear conductors (26) formed in/on the conductor layer covering the side faces, electrode portions (28) composed of the conductor layer covering the end faces, and a magnetic body portion (31) made of a sintered magnetic body and provided over the coil portion. The conductor layer has a melting point higher than the sintering temperature of the sintered magnetic body. A method for manufacturing the same comprises the steps of fabricating a base, forming a conductor layer, fabricating a coil portion, fabricating electrode portions on the end faces of the base, and fabricating a magnetic body portion of a sintered magnetic body over the coil portion. The inductance part which has a large inductance, from which the magnetic flux hardly leaks, and which hardly adversely magnetically influences the peripheral parts.

Inductance part and its manufacturing method

A method of manufacturing a chip inductor, comprising the conductive layer forming step of forming a conductive layer (4) on the outer peripheral surfaces (2) and end surfaces (3) of a substrate (1), the coil part forming step of forming a coil part (7) having conductive parts (5) and grooved parts (6) by grooving the conductive layer (4) in coil shape, the etching step of etching the substrate (1) having the coil part (7) formed thereon, the insulation resin coating step of forming an exterior part (8) by covering the conductive layer (4) with an insulation resin (13), and the electrode forming step of forming an electrode part (9) at both end parts of the coil part (7) and electrically connecting the electrode part (9) and the conductive layer (4), wherein, in the insulation resin covering step, the insulation resin layer (8) is formed by an electrodepositing method, whereby a chip inductor capable of making flat the installation surface of the exterior part and surely installing a substrate can be manufactured.

Hiromasa Yamamoto

Papers

Method of manufacturing a chip coil

Manufacture of inductor

Manufacture of chip inductor

Inductance part and its manufacturing method

Method of manufacturing chip inductor