A shielded medical device implanted in a biological organism. The device has a magnetic shield, and the magnetic shield contains a layer of nanomagnetic material; such layer has a morphological density of at least 98 percent; and it is bonded to the medical device by means of an interlayer with a thickness of less than about 10 microns. The nanomagnetic material in such layer has a saturation magnetization of from about 1 to about 36,000 Gauss, a coercive force of from about 0.01 to about 5,000 Oersteds, a relative magnetic permeability of from about 1 to about 500,000, and an average particle size of less than about 100 nanometers.

Magnetically shielded assembly

Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.

Semiconductor device packages with electromagnetic interference shielding

Multi-layered moldings and methods for manufacturing multi-layered moldings. A metallized layer (40) can be deposited on at least one side of a substrate (38). The substrate (38) can be shaped and then the metal layer (40) can be deposited onto the shaped substrate (38). Optionally, an injection molded resin (43) can be deposited onto the substrate (38) and/or metal layer (40).

Multi-layered structures and methods for manufacturing the multi-layered structures

The present invention provides a vacuum deposited metal layer that can shield the electronic components on a PCB or FPC. The vacuum metallized conductive layer can be grounded to a ground trace on the circuit board to create a Faraday cage to protect the electronic components disposed on the circuit board from EMI. The metallized conductive layer can be disposed over an encapsulating insulative layer or onto a shaped thermoform or mold injected plastic substrate that is coupled to the PCB or FPC.

Emi and rfi shielding for printed circuit boards

A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided The conductive connectors can be flexibly arranged within the molding compound for better shielding performance The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure

Chip package and manufacturing method thereof

An electromagnetic interference suppressing body is provided for suppressing electromagnetic interference by undesirable electromagnetic waves. The body can have a conductive support element and a non-conductive soft magnetic layer provided on at least one surface. The electromagnetic interference suppressing body may be used in circuit board electronic equipment and in a hybrid integrated circuit element having an active element and a passive element mounted on a circuit board.

Electronic device having the electromagnetic interference suppressing body

PURPOSE: To provide a material that has an electromagnetic shielding effect equivalent to a conductive shield member and limits the electromagnetic coupling due to the reflection of electromagnetic waves. CONSTITUTION: The electromagnetic wave interference suppressor comprises a conductive support 1, and an insulating soft magnetic material layer 2 provided at least on one surface of the support 1, wherein the layer 2 contains soft magnetic powder 3 and organic binder 4. A dielectric layer is provided on an upper or lower surface of the layer 2. The support 1 is a conductive soft magnetic support having soft magnetic properties. COPYRIGHT: (C)1995,JPO

Electromagnetic wave interference suppressor

Mittel mit geringer elektromagnetischer Transparenz und Reflexion zur Unterdrückung von elektromagnetischen Interferenzen und damit versehene elektronische Vorrichtung

Hitoshi Togawa

Papers

Electronic device having the electromagnetic interference suppressing body

Electromagnetic wave interference suppressor

Mittel mit geringer elektromagnetischer Transparenz und Reflexion zur Unterdrückung von elektromagnetischen Interferenzen und damit versehene elektronische Vorrichtung