Power consumption is forecast by the International Technology Roadmap of Semiconductors (ITRS) to pose long-term technical challenges for the semiconductor industry. The purpose of this paper is threefold: (1) to provide an overview of strategies for powering MEMS via non-regenerative and regenerative power supplies; (2) to review the fundamentals of piezoelectric energy harvesting, along with recent advancements, and (3) to discuss future trends and applications for piezoelectric energy harvesting technology. The paper concludes with a discussion of research needs that are critical for the enhancement of piezoelectric energy harvesting devices.

/pdf/powering-mems-portable-devices-a-review-of-non-regenerative-30r5zxggdp.pdf

Powering MEMS portable devices—a review of non-regenerative and regenerative power supply systems with special emphasis on piezoelectric energy harvesting systems

https://www.aeromech.usyd.edu.au/wwwcomp/pzferev.pdf

Advances in piezoelectric finite element modeling of adaptive structural elements: a survey

Recent interest in high-speed scanning probe microscopy for high-throughput applications including video-rate atomic force microscopy and probe-based nanofabrication has sparked attention on the development of high-bandwidth flexure-guided nanopositioning systems (nanopositioners). Such nanopositioners are designed to move samples with sub-nanometer resolution with positioning bandwidth in the kilohertz range. State-of-the-art designs incorporate uniquely designed flexure mechanisms driven by compact and stiff piezoelectric actuators. This paper surveys key advances in mechanical design and control of dynamic effects and nonlinearities, in the context of high-speed nanopositioning. Future challenges and research topics are also discussed.

/pdf/invited-review-article-high-speed-flexure-guided-4qdbjhhogg.pdf

Invited review article: high-speed flexure-guided nanopositioning: mechanical design and control issues.

A refined trigonometric shear deformation theory for thermoelastic bending of functionally graded sandwich plates

In this brief, we study the design of a feedback and feedforward controller to compensate for creep, hysteresis, and vibration effects in an experimental piezoactuator system. First, we linearize the nonlinear dynamics of the piezoactuator by accounting for the hysteresis (as well as creep) using high-gain feedback control. Next, we model the linear vibrational dynamics and then invert the model to find a feedforward input to account vibration - this process is significantly easier than considering the complete nonlinear dynamics (which combines hysteresis and vibration effects). Afterwards, the feedforward input is augmented to the feedback-linearized system to achieve high-precision highspeed positioning. We apply the method to a piezoscanner used in an experimental atomic force microscope to demonstrate the method's effectiveness and we show significant reduction of both the maximum and root-mean-square tracking error. For example, high-gain feedback control compensates for hysteresis and creep effects, and in our case, it reduces the maximum error (compared to the uncompensated case) by over 90%. Then, at relatively high scan rates, the performance of the feedback controlled system can be improved by over 75% (i.e., reduction of maximum error) when the inversion-based feedforward input is integrated with the high-gain feedback controlled system.

Feedback-Linearized Inverse Feedforward for Creep, Hysteresis, and Vibration Compensation in AFM Piezoactuators

Generalized finite element formulation for smart multilayered thermal piezoelectric composite plates

Previously developed discrete layer mechanics are extended to incorporate thermal effects to account for the complete coupled mechanical, electrical, and thermal response of piezoelectric composite beams. Thermal effects in both the elastic and piezoelectric media are captured at the material level. This unified representation leads to an inherent capability to model both the sensory and active responses of piezoelectric composite beams in thermal environments. Finite element equations are developed and implemented for a beam element with linear shape functions. Results from the current formulation are compared with results from a conventional thermoelastic finite element analysis and classical beam theory. Additional numerical studies demonstrate capabilities of the current formulation to predict the thermal deformation of composite beams, as well as the active compensation of these thermal deformations using piezoelectric structures. The corresponding sensory response and the resultant stress state in the piezoelectric composite beam are also presented. [Amn], [Bmn], [Dmn] b [C] {D} [d] {E} [Emn] [e] {F}

Coupled layerwise analysis of thermopiezoelectric composite beams

A mixed multi-field finite element formulation for thermopiezoelectric composite shells

A layerwise finite element formulation developed for piezoelectric materials is used to investigate the displacement and stress response of a functionally graded piezoelectric bimorph actuator. The formulation is based on the principles of linear thermopiezoelectricity and accounts for the coupled mechanical, electrical, and thermal responses of piezoelectric materials. The layerwise laminate theory is implemented into a linear beam element in order to provide a more accurate representation of the transverse and shear effects that are induced by the increased inhomogeneities introduced through-the-thickness by the functionally graded materials. The accuracy of the formulation is verified with previously published experimental results for a piezoelectric bimorph actuator. Additional studies are conducted to analyze the impact of electric and thermal loads on the deflections and stresses in a bimorph actuator. Results of the study help to demonstrate the capability of the layerwise theory to provide a more ...

Layerwise Laminate Analysis of Functionally Graded Piezoelectric Bimorph Beams

Analytical formulations for thermopiezoelectric composite materials are extended to account for thermal effects arising from temperature dependent material properties. The updated mechanics also has the inherent capability to capture thermal effects which arise due to coefficient of thermal expansion mismatch and pyroelectric phenomena, providing a comprehensive thermal analysis capability. The thermal effects are represented at the material level through the thermopiezoelectric constitutive equations. These equations are incorporated into a layerwise laminate theory to provide a unified representation of the coupled mechanical, electrical, and thermal response of piezoelectric composite materials. Corresponding finite element equations are derived and implemented for beams and plates to model the active and sensory response of piezoelectric composite laminates. Applications demonstrate the significance of incorporating temperature dependent material properties on the response of piezoelectric composite b...

Ho-Jun Lee

Papers

Generalized finite element formulation for smart multilayered thermal piezoelectric composite plates

Coupled layerwise analysis of thermopiezoelectric composite beams

A mixed multi-field finite element formulation for thermopiezoelectric composite shells

Layerwise Laminate Analysis of Functionally Graded Piezoelectric Bimorph Beams

The Effect of Temperature Dependent Material Properties on the Response of Piezoelectric Composite Materials