PURPOSE:To obtain metal-coated glass fibers having an electromagnetic wave shielding effect and FRP products using the same with good operability, by reacting an electrically conductive metallic salt and a reducing agent with the surface of glass fibers to form electrically conductive films thereon. CONSTITUTION:An electroless plating solution containing a metallic salt capable of forming electrically conductive metallic films and a reducing agent is reacted with the surface of glass fibers to reduce the metallic salt and form the electrically conductive metallic films thereon. The metallic films are a metal or alloy such as Ni, Cu, Co, Fe, Ni-Cu, Ni-P, Co-P, Co-Ni-P, Fe-Ni, Fe-Co, etc., and the film thickness is about 0.1-100mum. The metal-coated glass fibers are individually molded, lined or inserted into a casing or cover, etc. having the electromagnetic wave shielding effect, etc. or further incorporated or inserted into a plastic, molded into FRP products and used as electromagnetic wave shielding parts.

Metal-coated glass fiber, production thereof and frp product using said fiber

PURPOSE:To coat a ceramic substrate with Cu with satisfactory adhesion by degreasing the substrate, roughening the surface with tin fluoride and carrying out electroless Cu plating. CONSTITUTION:A ceramic substrate is degreased and the surface is roughened with tin fluoride. This tin fluoride is used as a soln. having 150-250g/l concn. and the surface is treated with the soln. at 40-60 deg.C for 10-30min. Electroless Cu plating is then carried out. Since Cu enters the fine surface recesses of the ceramic substrate, the sticking area is increased and the sticking force is improved.

Method for coating ceramic substrate with cu

PURPOSE:To apply a metallic coating film to the surface of glass or ceramic, with high adhesivity, by sensitizing the surface of the glass, etc. in an aqueous solution containing Sn ion and F ion, activating the surface, and carrying out the electroless plating. CONSTITUTION:The surface of glass or ceramic is ordinarily etched, and sensitized in an aqueous solution containing 0.76-37.9g of Sn ion and 0.24-12.1g of F ion per liter. The sensitized surface of the article to be treated is activated e.g. with an aqueous solution containing Pd or colloidal Pd and then immersed in an electroless plating bath containing e.g. 0.1mol of nickel sulfate, 0.2mol of sodium hypophosphite, and 0.1mol of sodium citrate to form an electrode film composed of Ni to the surface of the glass, etc. A fine metallic coating film having high adhesivity can be formed on the surface of glass or ceramic by this process without being affected with undesirable effects such as diffusion.

Honma Hideo

Papers

Electroless plating of glass and ceramic