An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

Methods of manufacturing a liquid crystal device including depositing a layer of liquid crystal material on a substrate and imprinting a pattern on the layer of liquid crystal material using an imprint template are disclosed. The liquid crystal material can be jet deposited. The imprint template can include surface relief features, Pancharatnam-Berry Phase Effect (PBPE) structures or diffractive structures. The liquid crystal device manufactured by the methods described herein can be used to manipulate light, such as for beam steering, wavefront shaping, separating wavelengths and/or polarizations, and combining different wavelengths and/or polarizations.

Virtual and augmented reality systems and methods

The present disclosure relates to a semiconductor light-emitting element, which comprises: a first light-emitting part, a second light-emitting part, and a third light-emitting part, wherein each of the light-emitting parts includes multiple semiconductor layers including a first semiconductor layer, an active layer, and a second semiconductor layer, laminated in sequence, the first semiconductor layer having a first conductivity, the active layer generating light through the recombination of an electron and a hole, and the second semiconductor layer having a second conductivity different from the first conductivity; a non-conductive reflecting film which is formed to cover the multiple semiconductor layers and reflects light generated from the active layer; a first electrode which is provided to electrically communicate with the first semiconductor layer of the first light-emitting part and which supplies one of an electron and a hole; a second electrode which is provided to electrically communicate with the second semiconductor layer of the second light-emitting part and which supplies the other of the electron and the hole; and an auxiliary pad formed on the non-conductive reflecting film which covers the third light-emitting part.

Semiconductor light emitting element

In a heat exchanger for exchanging heat between a fluid, such as a refrigerant, and air, an object is to increase the surface areas of the fins while suppressing an increase in draft resistance, so as to attain the improvement of performance. To this end, corrugated sheet fins (70) are used as the fins of a heat exchanger (60). The fins (70) are shaped in corrugated form, and the direction of their edge lines is orthogonal to the leading edge and trailing edge. In the heat exchanger (60), a plurality of corrugated sheet fins (70) are disposed at a fixed pitch axially of heat transmission pipes (61).

Heat exchanger, and air conditioner

PROBLEM TO BE SOLVED: To provide a high luminance semiconductor light emitting device that efficiently extracts light emitted on a photonic crystal structure forming region in a current constriction structure. SOLUTION: The semiconductor light emitting device 1A includes: a substrate 1; a GaN semiconductor layer 2 formed on one surface of the substrate 1; a current injection blocking layer 3 formed by radiating high energy onto a surface layer of the GaN semiconductor layer 2; the current constriction structure 4 formed at an inner end of the current injection blocking layer 3; a transparent conductive film 5 formed on a surface of the GaN semiconductor layer 2; the photonic crystal structure forming region 6 composed of a fine, uneven and regular aggregate that is formed extended from a surface of the transparent conductive film 5 to the interior of the GaN semiconductor layer 2; an insulating film 7 for covering the surface of the transparent conductive film 5; and an n-side electrode 8 and a p-side electrode 9 which are formed on an opening of the insulating film 7 and connected to an n-type cladding layer and a p-type cladding layer of the GaN semiconductor layer 2, respectively. COPYRIGHT: (C)2011,JPO&INPIT

Semiconductor light emitting device

PROBLEM TO BE SOLVED: To resolve a problem that a conventional heat exchanger employing a circular tube or a flat tube does not permit to improve remarkably a ventilating resistance or a heat transfer performance and contrive energy saving due to the restriction in manufacturing or structure. SOLUTION: A multitude of sheet type fins are arranged in parallel and flat type heat transfer tubes are inserted from the upstream side of air flow into groove holes to braze the tube to the fin whereby the heat exchanger, miniaturized in size, reduced in a ventilating resistance and excellent in heat transfer performance can be obtained.

Heat exchanger, refrigerating air conditioner and manufacturing method of heat exchanger

PROBLEM TO BE SOLVED: To solve problems wherein a heat exchange quantity of the whole heat exchanger reduces since a leeward side heat transfer pipe inside passage reduces in heat exchange efficiency though a windward side heat transfer pipe inside passage efficiently exchanges heat, and a flat heat transfer pipe is worse in drainability of dewing water than a circular pipe-shaped heat transfer pipe in a heat exchanger using the flat heat transfer pipe. SOLUTION: This heat exchanger has the heat transfer pipe arranging a plurality of passages inside a flat cross section bent in a U shape, a header for communicating with an end part of the heat transfer pipe, a vertical partition plate, and a horizontal partition plate for forming a refrigerant flow to an outflow pipe from an inflow pipe by separating a space in the header, and constitutes the refrigerant flow of an opposed flow or a parallel flow to a gas flow. COPYRIGHT: (C)2004,JPO

Heat exchanger and air conditioner using this heat exchanger

PROBLEM TO BE SOLVED: To provide a heat exchanger that has small draft resistance and at the same time excellent heat transfer performance, and an air-conditioning refrigerating device that uses the heat exchanger for reducing the amount of refrigerant to be used. SOLUTION: A plurality of plate-shaped fins 1 that are arranged in parallel and allow gas to flow among them, heat transfer pipes 2 that are inserted at right angle to each of the plurality of plate-shaped fins 1, allow operation fluid to pass through the inside, are provided in a plurality of stages in the stage direction vertical to a direction for allowing the gas to pass, at the same time, are provided in a plurality of rows in a row direction for allowing the gas to flow, has an external diameter D (3<=D<=7 mm), and has cut and raise that is provided on the surface of the plate-shaped fin and has an opening part opposite to the flow of the gas. A stage pitch Dp in the stage direction of the heat transfer pipe 2 is set to 2D<=Dp<=g3D, a row pitch Lp in the row direction of the heat transfer pipe is set to 2D<=Lp<=3.5D, a fin pitch Fp of the plate-shaped fin is set to 0.5D<=Fp<=0.7D, and thickness Ft of the plate- shaped fin is set to 6<=Fp/Ft<=18.

Heat exchanger and air-conditioning refrigerating device using the same

PROBLEM TO BE SOLVED: To provide a fin and tube type heat exchanger and an air conditioner using the same, keeping an approximately constant distribution ratio regardless of the amount of the entire refrigerant circulation. SOLUTION: This fin and tube type heat exchanger includes: first and second main heat exchangers 2a, 2b respectively constituted of a fin 4 formed by vertically stacking a plurality of plates with clearance gaps, and flat tubes 10 having a plurality of refrigerant flow channels, and disposed in the stage direction along the stacking direction of the fin 4 at prescribed intervals, and disposed in two lines orthogonally to the air flowing direction a; and a spare heat exchanger 3 constituted of a fin 4 formed by stacking a plurality of plates in the upward direction through clearance gaps, and circular tubes 11 disposed in the stage direction along the stacking direction of the fin 4 at prescribed intervals, and disposed at a windward side of the first main heat exchanger 2a. Front end sections of the flat tubes 10 of the first and second main heat exchangers 2a, 2b are projected from a windward side edge section of the fin 4, and the first and second heat exchangers 2a, 2b are disposed with a clearance gap so that the tip end section of the flat tube 10 of the second main heat exchanger 2b is not kept into contact with a leeward side of the fin 4 of the first main heat exchanger 2a. COPYRIGHT: (C)2011,JPO&INPIT

Fin tube-type heat exchanger and air conditioner using the same

PROBLEM TO BE SOLVED: To solve a problem of a fin tube type heat exchanger having a cut- and-erected slit, giving no consideration to a slit dimension and a distance between slits and insufficiently exhibiting a heat exchange capacity. SOLUTION: This fin tube type heat exchanger is provided with a plurality of plate-shaped fins 1 disposed in parallel to each other and allowing air to pass therethrough, a plurality of flat heat transmission pipes 2 orthogonally penetrating the respective plate-shaped fins 1, allowing operating fluid to pass through their inside, and provided in a step direction orthogonally to the air passing direction and in a row direction in the air passing direction, and the cut-and-erected slits 3 provided on the surfaces of the plate-shaped fins 1 and having openings facing to the air flow. The ratio of the width a of the cut-and- erected slit 3 to the distance b between the cut-and-erected slits 3 is set to 1≤b/a≤4. COPYRIGHT: (C)2003,JPO

晃石橋

Papers

Heat exchanger, refrigerating air conditioner and manufacturing method of heat exchanger

Heat exchanger and air conditioner using this heat exchanger

Heat exchanger and air-conditioning refrigerating device using the same

Fin tube-type heat exchanger and air conditioner using the same

Fin tube type heat exchanger, its manufacturing method, and refrigeration air conditioner

晃 石橋

Papers

Heat exchanger, refrigerating air conditioner and manufacturing method of heat exchanger

Heat exchanger and air conditioner using this heat exchanger

Heat exchanger and air-conditioning refrigerating device using the same

Fin tube-type heat exchanger and air conditioner using the same

Fin tube type heat exchanger, its manufacturing method, and refrigeration air conditioner

晃石橋