An ultrasonic vibration bonding method comprising placing metal portions to be bonded formed on a base portion of a first member upon metal portions to be bonded of a second member, pressing the first and second members with a resonator and a mounting table elastically while the base portion of the first member is located on a bonding working portion side of the resonator and the second member is located on a mounting table side, and bonding together the portions to be bonded of the first and second members with ultrasonic vibration transmitted to the resonator from a transducer. This ultrasonic vibration bonding method can improve work efficiency and prevent a connection failure and resin breakage.

Ultrasonic vibration bonding method

Apparatus for manufacturing dual in-line packages from a single continuous lead frame assembly and a number of leadless circuit modules. The apparatus includes a loading station where modules are positioned in spaces in the lead frame assembly, a closing station where leads carried by spaced carrier strips on both sides of the modules are moved toward the modules to engage the modules adjacent metalized pads and to collapse interconnecting rungs, a soldering station where the leads are soldered to the pads, a bending station where the leads are bent down with respect to the module through about 90 degrees, a cut off station for removing the carrier strips on either side of the lead frame assembly, and associated drives for moving the lead frame assembly past the various stations.

Apparatus for manufacturing dual in-line packages

A beam-lead bonder incorporates an automatically indexable feeder slide for feeding a selected integrated circuit device to a bonding station, and a shuttle table for positioning a particular bond site on a substrate in alignment with the selected device. The alignment can be checked by optical instrumentation and refined by a micromanipulator. Before bonding, the device is transferred to the bonding tip of the bonder, and the substrate is transferred to a bonding support. The feeder slide and the shuttle table retract, permitting the table to be loaded with a substrate for a subsequent bonding operation while bonding of the previously aligned device and substrate is taking place. The bonded substrate disengages from the bonding support after bonding and slides into a receiving tray.

Apparatus for bonding a beam-lead device to a substrate

A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (1) a first planar portion between the region and the front edge of the tip portion, and (2) a second planar portion between the region and the back edge of the tip portion.

Ribbon bonding tools and methods of using the same

A compliant pad or work piece for use in bonding the inner leads of integrated circuit devices as a part of a tape automated bonding process. The work piece is constructed of a metallic base layer to which is affixed a compliant pad, a cap support and a cap positioned on said compliant pad surrounding a gas channel which is connected to a source of gas such as nitrogen. A ceramic heat distribution layer is positioned over said gas channel and acts to support the integrated circuit device to be bonded to an associated tape during the tape automated bonding process.

Compliant pad for use in tape automated bonding process

Apparatus for compliant bonding beam-leads of a semiconductor element to metallized areas of a substrate. Lengths of uniform ribbon of a deformable material are disposed between a heated bonding tool and the beam-leads. The bonding tool is pressed against the lengths of ribbon to compress the beam-leads between the ribbons and the metallized areas for bonding. After bonding, the used lengths of ribbon are replaced by new lengths from continuous supplies stored on reels.

Hubert J Ramsey

Papers

Apparatus for bonding semiconductor elements