Showing papers by "Hyungsoo Kim published in 1998"
25 May 1998
TL;DR: In this article, the effects of the on-chip and off-chip decoupling capacitors to the power/ground bounce and the electromagnetic radiated emission were discussed and the design rule of the optimum placement of the decoupled capacitor was obtained.
Abstract: Recently, electromagnetic interference (EMI) and radiated emission has become a major problem for high-speed circuit and package designers, and it is likely to become even severe in the future. However, until recently, designers of integrated circuit and package did not give much consideration to electromagnetic radiated emission and interference in their designs. Decoupling capacitors have been mostly used to reduce the power/ground bounce of high-speed digital system and boards. However, there has not been a systematic study to understand the effects of on-chip and off-chip decoupling capacitors on the electromagnetic radiated emission. In this paper, we report the simulation and the measurement results regarding the radiated emission due to the power/ground bounce. And we discuss the effects of the on-chip and off-chip decoupling capacitors to the power/ground bounce and the electromagnetic radiated emission. This circuit is simulated using HSPICE. Test ICs and printed circuit boards were designed and fabricated. Using a transverse electromagnetic (TEM) cell, the radiated electric field of the device under test (DUT) is measured. Combined placement of the on-chip and off-chip decoupling capacitor achieves more than 10 dB suppression of the radiated emission on the whole spectrum region. The design rule of the optimum placement of the decoupling capacitor was obtained.
51 citations
25 May 1998
TL;DR: In this article, the authors proposed new embedded microstrip structures, such as an embedding microstrip (EM) and an inverted Embedding Microstrip (IEM) structures for the MCM-Si interconnection line.
Abstract: Recently, electrical performances of high-speed digital integrated circuits and MCMs have been limited by undesired RF phenomena of interconnection lines, such as delay attenuation, crosstalk, dispersion, reflection, and noise. Transmission line structures are required for future interconnection lines of the integrated circuits and MCMs to minimize the RF effects and, therefore, to maximize transmission bandwidth and minimize signal loss of the interconnection lines. Also, to predict those effects, it is necessary to use correct and simple electrical models of the transmission line structures. In this paper, we propose new embedded microstrip structures, such as an embedding microstrip (EM) and an inverted embedding microstrip (IEM) structures for the MCM-Si interconnection line. The proposed IEM and EM structures are proven to be less lossy and dispersive at high frequencies than the conventional MCM-Si interconnection line structures. The proposed line structures were demonstrated to support low loss quasi-TEM mode propagation through the lines. The characteristics and frequency dependent electrical models of the proposed structures will be reported based on microwave S-parameter measurements up to 20 GHz.
5 citations
24 Aug 1998
TL;DR: In this paper, a new clock and signal line scheme was introduced to suppress the radiated emission from the fast transition of the clock and data signals, and the proposed differential-line-scheme (DLS) could reduce radiated emissions by more than 10 dB compared to the conventional single-line scheme.
Abstract: Even though the electromagnetic radiated emission due to the ground and power line fluctuation of the integrated circuit (IC) and printed circuit board (PCB) is minimized, the additional reduction of the radiated emission from the clock and the signal lines are not easy In this paper, we introduce a new clock and signal line scheme to suppress the radiated emission from the fast transition of the clock and data signals We proved that the proposed differential-line-scheme (DLS) could reduce the radiated emission by more than 10 dB compared to the conventional single-line-scheme (SLS) First, we report the necessity and the usefulness of the differential-line-scheme and explain the operation of the inverter circuit for the differential-line-scheme using HSPICE simulation Test ICs and PCBs were designed and fabricated, to verify the effect of differential-line-scheme with the proposed inverter circuit The electromagnetic radiated emission due to the device under test (DUT) is measured using a gigahertz transverse electromagnetic (GTEM) cell The measured result has shown that the differential-line-scheme with the proposed inverter circuit achieves more than 10 dB suppression of the electromagnetic radiated emission The results confirm that the clock and signal line is fundamental source of the radiation The proposed differential-line-scheme with the proposed inverter circuit will be useful for both high-speed digital IC and PCB design
1 citations