A system includes a semiconductor device. The semiconductor device includes a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single crystal silicon layer, wherein the at least one metal layer comprises copper or aluminum more than other materials; and a second single crystal silicon layer overlying the at least one metal layer. The second single crystal silicon layer comprises a plurality of second transistors arranged in substantially parallel bands. Each of a plurality of the bands comprises a portion of the second transistors along an axis in a repeating pattern.

System comprising a semiconductor device and structure

A device comprising semiconductor memories, the device comprising: a first layer and a second layer of layer-transferred mono-crystallized silicon, wherein the first layer comprises a first plurality of horizontally-oriented transistors; wherein the second layer comprises a second plurality of horizontally-oriented transistors; and wherein the second plurality of horizontally-oriented transistors overlays the first plurality of horizontally-oriented transistors.

Semiconductor device and structure

A method to process an Integrated Circuit device including processing a first layer of first transistors, then processing a first metal layer overlaying the first transistors and providing at least one connection to the first transistors, then processing a second metal layer overlaying the first metal layer, then processing a second layer of second transistors overlaying the second metal layer, wherein the second metal layer is connected to provide power to at least one of the second transistors.

Method for fabrication of a semiconductor device and structure

The intensive investment in optical microelectromechanical systems (MEMS) in the last decade has led to many successful components that satisfy the requirements of lightwave communication networks. In this paper, we review the current state of the art of MEMS devices and subsystems for lightwave communication applications. Depending on the design, these components can either be broadband (wavelength independent) or wavelength selective. Broadband devices include optical switches, crossconnects, optical attenuators, and data modulators, while wavelength-selective components encompass wavelength add/drop multiplexers, wavelength-selective switches and crossconnects, spectral equalizers, dispersion compensators, spectrometers, and tunable lasers. Integration of MEMS and planar lightwave circuits, microresonators, and photonic crystals could lead to further reduction in size and cost

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Optical MEMS for Lightwave Communication

A chemical vapor deposition apparatus is disclosed, which is capable of improving the yield by an extension of a cleaning cycle, the chemical vapor deposition apparatus comprising a chamber with a substrate-supporting member for supporting a substrate; a chamber lid with plural first source supplying holes, the chamber lid installed over the chamber; plural source supplying pipes for supplying a process source to the plural first source supplying holes; a spraying-pipe supporting member with plural second source supplying holes corresponding to the plural first source supplying holes, the spraying-pipe supporting member detachably installed in the chamber lid; and plural source spraying pipes with plural third source supplying holes and plural source spraying holes, the plural source spraying pipes supported by the spraying-pipe supporting member, wherein the plural third source supplying holes are supplied with the process source through the plural second source supplying holes, and the plural source spraying holes are provided to spray the process source onto the substrate

Chemical vapor deposition apparatus

A continuous flow, steady state fluid delivery and recovery system for a process chamber and processes requiring supercritical fluid and desired additives including co-solvents, for conducting repetitive batch processing operations in an automated environment, for such processes as supercritical carbon dioxide cleaning and processing of semiconductor wafers. The system provides for steady-state operation of fluid flow and byproducts recovery while the process chamber is brought rapidly and repeatedly on and off line as in batch operations and for various process steps.

Supercritical fluid delivery and recovery system for semiconductor wafer processing

An apparatus and method for drying a microelectronic structure on wafer substrate using supercritical phase gas techniques and a unique pressure vessel locking mechanism. There is lid and a base with an open cavity to contain at least one microelectronic structure on wafer substrate. Clamping the lid to the base uses locking clamp rings with open jaws large to partially enclose the edge of the vessel. The clamp rings are supported symmetrically about the sides of the vessel. The rings are adjusted between an open position where the rings are clear of the vessel and a locking position where the jaws partially enclose the vessel. The jaws and the vessel share a tapered cam plate and roller system configured to bring the rings into vertically compressive locking engagement on the pressure vessel when the rings are moved into locking position. Mechanical interlocks provide security against back pressure opening the rings. The invention includes the necessary mechanisms and systems for manual or automatic closing and clamping the vessel, controlling pressure in the cavity, controlling temperature in the cavity, flowing process fluid through the cavity, venting the cavity, unclamping the pressure vessel, and removing the lid.

Supercritical phase wafer drying/cleaning system

A method and apparatus for fabricating and drying wafers (13), including micro-electronics mechanical systems (MEMS) structures, in a second supercritical processing fluid environment. The apparatus utilizes an inverted pressure vessel (11) connected to a supercritical processing fluid supply and recovery system, with an internal heat exchanger (9) connected to external heating and cooling sources, which is closed with a vertically movable base (10). A wafer cassette (14) configured for supporting multiple wafers (13) is submerged in a first processing fluid within a container (12), which is installed on the base plate (10) for insertion onto the pressure vessel (11). Vessel (11) inlet (2) and outlet (5) tubes extend vertically downward from the ceiling of the pressure vessel (11) to nearly the base plate (10). Container (12) inlet (1) and outlet (4) tubes extend vertically down from the ceiling of the pressure vessel (11) to the inside of the container (12) and nearly to the bottom of the container (12).

Supercritical fluid drying system

A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, a capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; viewing windows are opened in the active layer of the resonator wafer; masking the single crystal silicon semiconductor material active layer of the resonator wafer with photoresist material; a single crystal silicon resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist material is subsequently dry stripped.

Method of manufacturing vibrating micromechanical structures

A dry process for the cleaning of precision surfaces such as of semiconductor wafers, by using process materials such as carbon dioxide and useful additives such as cosolvents and surfactants, where the process materials are applied exclusively in gaseous and supercritical states. Soak and agitation steps are applied to the wafer, including a rapid decompression of the process chamber after a soak period at higher supercritical pressure, to mechanically weaken break up the polymers and other materials sought to be removed, combined with a supercritical fluid flush to carry away the loose debris.

Ijaz Jafri

Papers

Supercritical fluid delivery and recovery system for semiconductor wafer processing

Supercritical phase wafer drying/cleaning system

Supercritical fluid drying system

Method of manufacturing vibrating micromechanical structures

Supercritical fluid cleaning process for precision surfaces