The present invention is directed to perform fine low-voltage control without largely increasing the circuit layout area in a low-power consumption structure. In the case of shifting a region to a low-speed mode, a system controller outputs a request signal and an enable signal to a power switch controller and a low-power drive circuit, respectively, to turn off a power switch and to perform a control so that the voltage level of a virtual reference potential becomes about 0.2 V to about 0.3V. The region operates on voltages between a power supply voltage and a virtual reference potential, so that it is controlled in the low-speed mode.

Semiconductor Integrated Circuit Device

A semiconductor integrated circuit has a central processing unit and a rewritable nonvolatile memory area disposed in an address space of the central processing unit. The nonvolatile memory area has a first nonvolatile memory area and a second nonvolatile memory area, which memorize information depending on the difference of threshold voltages. The first nonvolatile memory area has the maximum variation width of a threshold voltage for memorizing information set larger than that of the second nonvolatile memory area. When the maximum variation width of the threshold voltage for memorizing information is larger, since stress to a memory cell owing to a rewrite operation of memory information becomes larger, it is inferior in a point of guaranteeing the number of times of rewrite operation; however, since a read current becomes larger, a read speed of memory information can be expedited. The first nonvolatile memory area can be prioritized to expedite a read speed of the memory information and the second nonvolatile memory area can be prioritized in guaranteeing the number of times of rewrite operation of memory information more.

Semiconductor Integrated circuit

A rubber composition for a tire tread includes an organosiloxane-modified diene polymer or a blend of the organosiloxane-modified diene polymer with another diene polymer and a silica or a mixture of the silica and carbon black, the organosiloxane-modified diene polymer being obtained by (a) polymerizing a diene monomer alone or a mixture of the diene monomer and aromatic vinyl monomer by the use of an alkali metal-containing polymerization initiator in a hydrocarbon solvent to give a diene polymer having an alkali metal-containing active end, and (b) reacting the alkali metal-containing active end of the diene polymer with an organosiloxane having at least one functional group selected from epoxy, alkoxyl, carbonyl, vinyl, chloro, bromo and iodo groups. The rubber composition for a tire tread is superior in processability and has both low rolling resistance and high wet-skid resistance by employing a decreased amount of a silane coupling agent.

Rubber composition for tire tread

An integrated circuit (IC) chip package is formed by extending the overall dimensions of a standard IC on a semiconductor substrate, typically a first silicon wafer, to provide an integral band of semiconductor material therearound on which are formed a series of spaced IC chip input/output pad areas extending along the band. A bottom peripheral edge of a discrete cap of the same semiconductor material, e.g. silicon, is sealingly affixed around an inner periphery of the band inboard of the series of pad areas and outboard of the IC active circuit areas, so that the cap interior spacedly covers the active circuit area and the input/output pad areas are exposed. The caps may be made by photolithography and microetching techniques from a second semiconductor wafer of the same type as the IC wafer. Metallization extends on the first wafer from connect pads on the active circuit area to the extended and exposed input/output pad areas exterior of the cap. The IC may be probed for test purposes prior to capping. Use of lead frames, plastic encapsulation processes and a ceramic housing are avoided, while maximizing the use of compatible materials having the same coefficient of thermal expansion. In one embodiment, essentially an "all silicon" package is provided.

Integrated circuit chip sealing assembly

A method of controlling an automatic transmission for a motor vehicle having a plurality of operating positions such that the operating positions are automatically selected. A plurality of control rules and a plurality of logical equations are provided such that the control rules and logical equations correspond to the operating positions of the transmission. Each of the control rules consists of a plurality of sub-rules for effecting determinations associated with running conditions of the motor vehicle. A logical operation of each control rule is performed according to a corresponding one of the logical equations, based on results of the determinations of the sub-rules corresponding to each control rule. A decision is made as to whether the each control rule is satisfied, or not. The transmission is shifted to one of the operating positions which corresponds to the control rule which is satisfied.

Control method and apparatus for shifting automatic transmission from one position to another

PURPOSE:To enable the element layout and inter-element wiring to be made by a mechanical system without increasing the space by a method wherein the active regions of high load driving elements are extended to wiring regions, multiple connecting electrodes are provided on respective logic electrodes, and layout positions of adjacent rows are slipped off. CONSTITUTION:The high load driving elements comprise the elements on the right side of upper step element row 2 and on the lower step element row 2; source.drain regions 7, 8 of MOSFET and gate electrodes 8 are extended to wiring regions; and the channel width of MOSFET is widened to give high driving capacity. Besides, when both elements laid out on adjacent element row 2 are the high load driving elements, the elements are laid out on slipped off positions not to make the extended source.drain regions 7, 8 shortcircuit with each other. When the elements are laid out on slipped off positions, the automatic layout being made unfeasible due to the slip off from the lattice points used for the inter-element wiring, the electrodes for interelement wiring are provided on the lattice point. Through these procedures, a semiconductor integrated circuit with logic circuit in high driving capacity can be made without increasing the space.

Semiconductor integrated circuit

PURPOSE:To simplify the structure of circuits by a method wherein the parallel- connected fundamental circuit composed of a switch and a capacitor of the title device is used as a block, the control terminal with which each switch in a block will be controlled is made common for each block, and an excellent relative accuracy of capacitance for the temperature variation in the device is obtained. CONSTITUTION:The fundamental circuit of a variable capacitance device is composed of a plurality of blocks 25, 26 and 27, and each of the blocks 25, 26 and 27 is provided with at least one pair of switch 16 and a capacitor 16 for closing and opening a circuit. A variable capacitance detecting terminal 22, to which capacitor 23 is connected in paralle, is connected to the blocks 25, 26 and 27. Also, control terminals 13, 14 and 15 are connected to each switch 19 respectively, and the capacitance of the terminal 22 is changed by controlling the ON-OFF operation of the switch 19. Then, the excellent relative accuracy of capacitance to the temperature variation in the device is measured.

Variable capacitance device

PURPOSE:To provide the tread rubber composition excellent in the edging effect, performance on the ice, braking performance, and durability by compounding a rubber component such as natural rubber with the ground product of egg shell in a specific ratio. CONSTITUTION:The composition comprises (A) 100 pts.wt. of a rubber component consisting mainly of natural rubber and a dienic synthetic rubber and (B) 5-50 pts.wt. of the ground product of egg shell.

Thread rubber composition for studless tire

PROBLEM TO BE SOLVED: To provide a tread rubber composition capable of providing rolling resistance characteristics and durability (particularly abrasion resistance) with good balance, and to provide a pneumatic tire having a tread manufactured using the same. SOLUTION: The tread rubber composition contains: a rubber component in which a total content of natural rubber and isoprene rubber is ≥65 mass% and a content of butadiene rubber modified with a compound represented by formula (1) is ≥5 mass%; silica; carbon black; and an alkylphenol-sulfur chloride condensate represented by a specific formula, wherein a content of the silica is 10-45 pts.mass, a content of the carbon black is 10-40 pts.mass, and a content of the alkylphenol-sulfur chloride condensate is 0.2-2.5 pts.mass, based on 100 pts.mass of the rubber component. In formula (1), R 1 , R 2 and R 3 are the same or different and represent alkyl, alkoxy, silyloxy, acetal, carboxyl, mercapto or derivatives of these; R 4 and R 5 are the same or different and represent H, alkyl or cyclic ether; and n represents an integer. COPYRIGHT: (C)2011,JPO&INPIT

Tread rubber composition and pneumatic tire

PROBLEM TO BE SOLVED: To provide a rubber composition for an inner tube and a rubber composition for an inner liner hardly generating cracks in the rubber and having excellent productivity. SOLUTION: The rubber composition for the inner tube or the rubber composition for the inner liner comprises 100 pts.wt. of a rubber component, ≤2 pts.wt. of zinc oxide and 1-5 pts.wt. of a mixed resin composed of aliphatic and aromatic resins. COPYRIGHT: (C)2009,JPO&INPIT

Ishida Hiroichi

Papers

Semiconductor integrated circuit

Variable capacitance device

Thread rubber composition for studless tire

Tread rubber composition and pneumatic tire

Rubber composition for inner tube and rubber composition for inner liner