A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.

Probe for combined signals

A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Probe for testing a device under test

A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test.

Active wafer probe

A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.

Shielded probe for testing a device under test

A system that includes an imaging device for effectively positioning a probe for testing a semiconductor.

Ivlev Mikhail A

Papers

Method of measuring spectral density of noise level and noise coefficient of four-terminal network