An organic light-emitting display includes a first substrate which includes a pixel region, and an encapsulation region which surrounds the pixel region, an organic light-emitting device which is located in the pixel region, a sealant which is located in the encapsulation region, and a dummy metal which is interposed between the first substrate and the sealant, where the encapsulation region includes a first encapsulation region and a second encapsulation region which is adjacent to the first encapsulation region, and the dummy metal is located in the first encapsulation region.

Organic light emitting display

The present disclosure relates to a semiconductor light-emitting element, which comprises: a first light-emitting part, a second light-emitting part, and a third light-emitting part, wherein each of the light-emitting parts includes multiple semiconductor layers including a first semiconductor layer, an active layer, and a second semiconductor layer, laminated in sequence, the first semiconductor layer having a first conductivity, the active layer generating light through the recombination of an electron and a hole, and the second semiconductor layer having a second conductivity different from the first conductivity; a non-conductive reflecting film which is formed to cover the multiple semiconductor layers and reflects light generated from the active layer; a first electrode which is provided to electrically communicate with the first semiconductor layer of the first light-emitting part and which supplies one of an electron and a hole; a second electrode which is provided to electrically communicate with the second semiconductor layer of the second light-emitting part and which supplies the other of the electron and the hole; and an auxiliary pad formed on the non-conductive reflecting film which covers the third light-emitting part.

Semiconductor light emitting element

The present invention is aimed to prevent occurrence of COD and rapid degradation of light output in semiconductor laser devices. The semiconductor laser device includes a semiconductor laser element 100A and a support member 200. The semiconductor laser element 100a includes a first electrode 13, a substrate 11, and a semiconductor structure 12 having an emitting facet and a reflecting facet, a second electrode 15, and a pad 16, in this order. The semiconductor laser element 100A is connected to a support member 200 at its pad 16 side via a connecting member 300. The emitting-side end portion of the second electrode 15 is spaced apart from the emitting facet of the semiconductor structure 12, and the emitting-side end portion of the pad 16 is located at an outer side than the emitting-side end portion the second electrode 15.

Semiconductor laser device

An adhesion layer of a hexagonal crystal is laid on a facet an optical resonator of a nitride semiconductor laser bar having a nitride-based III-V group compound semiconductor layer, and a facet coat is laid on the adhesion layer. In this way, a structure in which the facet coat is laid on the adhesion layer is obtained.

Nitride semiconductor light-emitting device and method for fabrication thereof

According to one embodiment, a television apparatus includes a main body, a housing, an exothermic component, and a heat transfer mechanism. The main body has a display screen, and is used in a first orientation where one side of the display screen is positioned on the upper side and in a second orientation where another side is positioned on the upper side. The housing at least partially constitutes the outline of the main body. The exothermic component is housed in the housing. The heat transfer mechanism includes a heat receiving portion that receives heat from the exothermic component, a heat releasing portion that releases heat, and a heat transferring portion that houses a medium to transfer heat from the heat receiving portion to the heat releasing portion. In both the first orientation and the second orientation, the heat receiving portion is located lower than the heat releasing portion.

Television Apparatus and Electronic Device

PROBLEM TO BE SOLVED: To provide a semiconductor laser device having the low number of components SOLUTION: The semiconductor laser device is provided with an optical base mount 5 equipped with a substantially spherical recess 13 therein, a tuning base 5 having a substantially spherical projection 11 which is fitted in the recess 13 and an optical package 2 installed on the tuning base 5 The tuning base 5 is provided with a substantially flat surface 12 at the side opposed to the projection 11 while the optical package 2 is equipped with a semiconductor laser element therein and is installed on the substantially flat surface 12 COPYRIGHT: (C)2006,JPO&NCIPI

An image display apparatus of the present invention includes: a display device for displaying an image; a heat-receiving tube that is disposed so as to be in thermal communication with the display device and is filled with a cooling liquid; a heat-radiating tube that is provided to be continuous with the heat-receiving tube and is filled with the cooling liquid; and a transporting pump allowing the cooling liquid to circulate through the heat-receiving tube and the heat-radiating tube. When viewed from a display surface side of the display device, at least a part of the heat-radiating tube is located outside a peripheral edge of the display device and is disposed along the peripheral edge.

Image display apparatus

PROBLEM TO BE SOLVED: To provide a solid-state imaging device wherein a solid-state imaging element and a prism are bonded, which can solve the problem caused by bonding the solid-state imaging element and the prism with an adhesive and suppress reduction in precision of registration SOLUTION: In a bonding structure of a solid-state imaging element and a prism, a decompressed space forming part for forming a decompressed space where the pressure is reduced lower than the ambient atmosphere is arranged in the bonding part of the solid-state imaging element and the prism By the pressure of the decompressed space, the solid-state imaging element and the prism are bonded, thus obtaining a bonding structure without using an adhesive COPYRIGHT: (C)2008,JPO&INPIT

Solid-state imaging device

PROBLEM TO BE SOLVED: To solve the following problems: generation of an analysis mesh model largely affects a result of numerical analysis, and experience and proficiency are required; and a designer having little experience or proficiency is difficult to execute the numerical analysis with accuracy and a time equivalent to a full-time person. SOLUTION: In mesh generation and shape simplification of an analysis model performed in the analysis mesh model generation, by satisfying a permissible level set according to an importance level of a component, the designer having little experience or proficiency can execute the numerical analysis with the accuracy and the time equivalent to the full-time person. COPYRIGHT: (C)2007,JPO&INPIT

Analysis mesh model generation device, analysis mesh model generation method and analysis mesh model generation program

The heatsink structure for solid-state image sensors comprises a foil-like heatsink sheet made of a high heat conductivity material, the heatsink sheet having a first fixed portion fixed to a solid-state image sensor and a second fixed portion fixed to another member, and having a plurality of cutout portions formed along directions from the first fixed portion toward the second fixed portion. Thus, the invention realizes a heatsink structure for cooling the solid-state image sensor while reducing any external-force loads applied to the solid-state image sensor with a relatively simple structure.

Iwata Yukihiro

Papers

Semiconductor laser device

Image display apparatus

Solid-state imaging device

Analysis mesh model generation device, analysis mesh model generation method and analysis mesh model generation program

Heatsink structure for solid-state image sensor