Multichip module technology has been shown to offer significant improvements for electronics equipment in the areas of miniaturized size, reduced weight, capability for higher frequency operation, improved thermal performance, and improved reliability. Production applications for multichip modules (MCMs) have grown from high-end computer and aerospace modules to include such diverse products as telecommunications, automotive, and consumer electronics modules. One of the keys to economic success in all applications is the achievement of high manufacturing yields. Yield losses must be kept very low compared with module costs in order to remain economically competitive. Two parameters with a very strong impact on manufacturing yield, known-good components entering assembly and test strategies at various levels of assembly, are discussed. Current industry practice is surveyed and recent progress on MCM infrastructure development is summarized. >

High-yield assembly of multichip modules through known-good IC's and effective test strategies

Multichip module packaging has been shown over the last few years to offer significant improvements for electronics equipment in the areas of miniaturized size, reduced weight, capability for higher frequency operation, improved thermal performance, and improved reliability. Production application of multichip modules (MCM's) have grown from high-end computer and aerospace modules to include such diverse products as telecommunications, automotive, and consumer electronics modules

High-yield assembly of multichip modules through known-good IC-s and effective test strategies : Multichip module technology

This paper highlights the development and effectiveness of a multichip module (MCM) Design-For-Testability methodology for an application intended for use in a fully electronic active matrix LCD flight instrument. MCM test issues discussed include Design-For-Testability, substrate test, Known-Good Die (KGD) and module level test.

The design incorporates IEEE 1149.1 and Built-In-Self-Test features. Bare die pretest is accomplished with a Ball Grid Array (BGA) chip carrier approach.

The hardware consists of a mature digital design comprised of application specific and industry standard integrated circuits.

Design-For-Test in a Multiple Substrate Multichip Module

The advent of novel advanced packaging technologies such as multilayer thin‐film interconnect, combined with continuous improvements in IC clock speed and circuit performance, has placed extreme demands on electronics packaging and package materials. Aluminium nitride (AIN) ceramic offers significant opportunities and advantages for package design, particularly where the effective thermal management and overall reliability of large devices are a high priority. AIN has already been successfully employed at the substrate level for the enhanced thermal relief of power devices. Examples of these applications include heat sinks and device mounts for thyristor modules, power transistors, solid state relays, power SCRs, switching modules, LEDs and various RF package configurations. Both bare and metallised AIN substrates are beginning to find application as a substitute for beryllia (BeO) in mass market and high reliability automotive electronics applications. Successfully implementing AIN in a high level electronics packaging application requires a systems approach in which the intrinsic properties of AIN are considered as ‘first principles’ in shaping the package design process. The unique physicochemical and mechanical properties of AIN require the development of specialised metallisation and co‐firing processes to fabricate the advanced components necessary for hermetic packaging of complex devices and multichip modules. This paper presents a practical and mass manufacturable AIN‐based package tailored to these high level applications. The package design is unique in that it provides for the total separation of the electrical‐signal conduction from the mechanical support/mounting functions of the package. Such a separation of the functions improves both the package durability and reliability relative to currently available electronics packages of conventional designs.

J.C. Mather

Papers

Robust Aluminium Nitride Package Technology for Multichip Modules