Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

Electromigration of solder joint under high dc current density is known as a reliability concern for the future high-density flip chip packaging and power packaging. Biased mass diffusion within solder joint from cathode to anode under high dc current density is observed in these experiments. In this letter, the experiments on flip chip solder joints under dc current stressing are conducted and thermomigration due to the thermal gradient in the solder joint caused by joule heating is reported. A three-dimensional coupled electric thermal finite-element (FE) simulation of a realistic flip chip module shows the existence of thermal gradient in the solder joint which is high enough to trigger thermomigration.

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Introduction Selection Procedure Materials Insulating Substrate and Metallization Base Plate Bonding Material Power Interconnection and Terminal Encapsulant Plastic Case and Cover Manufacturing of Power IGBT Modules Manufacturing Process Process Control/Long-Term Reliability Manufacturing Facilities Manufacturing Flow Charts Design Thermal Management Circuit Partitioning Design Guidelines and Considerations Thermal Results of Different Samples

Power Electronic Modules: Design and Manufacture

Damage mechanics of electromigration induced failure

https://www.eng.buffalo.edu/Research/packaging/publication/Paper2001-2002/Basaran2002b.pdf

Measuring intrinsic elastic modulus of Pb/Sn solder alloys

Electronic Packaging Materials and Their PropertiesElectronic Equipment Packaging TechnologyReliability and Failure of Electronic Materials and DevicesSpringer Handbook of Electronic and Photonic MaterialsModeling, Analysis, Design, and Tests for Electronics Packaging beyond MooreElectronic PackagingPortable Consumer ElectronicsSemiconductor PackagingAdvanced Electronic PackagingPower Electronic PackagingMechanical Analysis of Electronic Packaging SystemsFood PackagingMicroelectromechanical SystemsHigh Temperature ElectronicsElectrical Conductive Adhesives with NanotechnologiesElectronic Packaging of High Speed CircuitryPrinted Circuit Board Materials HandbookElectronic Packaging Materials and Their PropertiesNano-BioElectronic, Photonic and MEMS PackagingAdvanced Materials for Thermal Management of Electronic PackagingModeling and Simulation for Microelectronic Packaging AssemblyMaterials for Electronic PackagingMaterials for Advanced PackagingHandbook of Electronics Manufacturing EngineeringElectronic Packaging for High Reliability, Low Cost ElectronicsWide Bandgap Power Semiconductor PackagingThe Electronic Packaging HandbookMaterials for High-Density Electronic Packaging and InterconnectionHarsh Environment ElectronicsMaterials for High-Temperature Semiconductor DevicesAdvanced Adhesives in ElectronicsNanopackagingElectronic CompositesEssentials of Electronic PackagingElectronic Packaging Materials and Their PropertiesElectronic Packaging Materials and Their PropertiesNanopackagingElectronic Packaging and Interconnection HandbookMicrowave and Millimeter-Wave Electronic PackagingAdvanced Electronic Packaging Materials: Volume 167

J.J. Shea

Papers

Electronic packaging materials and their properties