J
Jae M. Park
Publications - 12
Citations - 722
Jae M. Park is an academic researcher. The author has contributed to research in topics: Substrate (printing) & Offset (computer science). The author has an hindex of 10, co-authored 12 publications receiving 722 citations.
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Patent
High frequency chip packages with connecting elements
TL;DR: In this paper, a radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate.
Patent
Microelectronic packages with self-aligning features
TL;DR: In this paper, the alignment elements on different parts of the substrate engage one another during the folding process to position the parts of a substrate precisely relative to one another, and one or more of these alignment elements may be a mass of an overmolding encapsulant covering a chip.
Patent
Solid state lighting device
Jae M. Park,Teck-Gyu Kang +1 more
TL;DR: A light assembly for use with a low voltage power source is described in this article, where the light assembly semiconductor photo-emitters are electrically in series with a higher forward voltage drop than the associated low-voltage power supply.
Patent
Image sensor package and fabrication method
Teck-Gyu Kang,Michael Estrella,Jae M. Park,Kenneth Robert Thompson,Craig Mitchell,Belgacem Haba +5 more
TL;DR: In this article, an image sensor package is described that reduces the amount of space in the package by allowing at least one surface of the image sensor controller and at least two surfaces of the sensor to be directly attached or connected to one another.
Patent
Components with posts and pads
TL;DR: In this paper, the connection component of a packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectrics, and pads (30) exposed at the outer surfaces of the layer, the pads being connected to the posts by the traces.