A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips

A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits

A compressible thermally conductive member comprises a polymer field with thermally conducting magnetically aligned particles comprising a base portion and a multiplicity of protrusions extending from at least one surface of the base portion.

Thermal conductor assembly

A method for mounting a semiconductor chip on a circuit board is provided that comprises forming a wiring pattern, which is to be connected with electrodes of the semiconductor chip, on the circuit board; attaching an insulating film, which has at least one hole that fits the shape of the electrodes of the semiconductor chip, to the top of the wiring pattern and the exposed portion of the circuit board; filling the hole formed in the insulating film with a conductor; and placing the semiconductor chip on the insulating film, so that the electrodes of the semiconductor chip are connected electrically with the wiring pattern on the circuit board through the conductor.

Method for mounting a semiconductor chip

A method of connecting an integrated circuit chip to a wiring substrate having a wiring pattern formed thereon. The method is intended to make a connection between fine connecting portions on the substrate and connecting pads on the chip easy and reliable. The connecting method includes connecting a plurality of connecting portions formed on a major surface of a wiring substrate to a plurality of connecting pads formed on a major surface of an integrated circuit chip through metal bumps and adhering portions of the major surface of the wiring substrate which have no connecting portions to portions of the major surface of the integrated circuit chip which have no connecting pads by means of a photothermosetting resin film selectively opened at the connecting portions.

Method of connecting an integrated circuit chip to a substrate

A primarily polycrystalline but partially amorphous electrical insulator can hermetically seal first and second spaced electrical terminals, one made from an anodized aluminum and the second made from a beryllium copper or Kovar or an alloy of beryllium, copper, nickel and gold. Nickel may be diffused into the beryllium copper and a noble metal may be deposited on the nickel. The insulator provides a flat meniscus to abut a corresponding electrical insulator in a cable. The insulator may provide an electrical impedance of approximately 50 ohms, an electrical resistivity greater than approximately 10 18 ohms and a dielectric constant of approximately 6.3. The insulator operates satisfactorily in a frequency range to approximately 40 gigahertz. The insulator may be made from the following mixture: Range of Relative Material Amounts by Weight Red Lead (PbO) 156-279 Silicon Dioxide (Quartz) 340 Sodium Carbonate 139-165 Potassium Carbonate 151-189 Lithium Carbonate  64-148 Boric Acid 111-183 Calcined Alumina  47-128 The mixture may be converted into a frit by heating it at about 400° F. for about 10 minutes, then at about 600° F. for about 60 minutes and then at about 1500° F. for about 120 minutes. The mixture may be stirred while being heated at about 600° F. and 1500° F. The mixture may then be quenched in water to form an electrical assembly. The frit may be disposed between the first and second terminals and the assembly may be formed by heating at about 200° F. for about 1 hour and then at about 1040° F. for about 40 minutes.

James C. Kyle

Papers

Terminal assembly and method of forming terminal assembly