A metal oxide semiconductor (MOS) integrated circuit (IC) has a plurality of fiducial standard cells of different cell sizes. The different cell sizes are non-equally utilized. The plurality of fiducial standard cells are placed to have a random offset from a uniform global placement pattern. Each of the fiducial standard cells has at least four power rails and various sets of active regions. The power rails extend in a first direction. The active regions are provided adjacent to the power rails but are disconnected from contacts and interconnects and thus do not draw power from the power rails. Instead, the active regions are disjoint and collinear thereby creating islands of active regions among spacings of inactive regions. These inactive regions more easily allow electromagnetic radiation to pass through thereby allowing the MOS fiducial standard cell to be visible for a CAD-to-silicon backside image alignment even with 7 nm feature sizes.

Visible alignment markers/landmarks for CAD-to-silicon backside image alignment

PURPOSE: A nano/micro roller bearing with a tolerance compensation function and a manufacturing method thereof are provided to effectively absorb the mechanical process tolerance of a microelectromechanical system (MEMS) structure and to minimize the deformation of the roller bearing. CONSTITUTION: A nano/micro roller bearing (100) with a tolerance compensation function is installed between two MEMS structures which are relatively motioned. The bearing is a roller bearing of a tube form with a C-shaped cross-section where gaps (110) of a constant distance are formed. The roller bearing is formed of a silicon material. Aluminum is charged in an internal space of the roller bearing. Polymer is charged in the internal space of the roller bearing.

Tolerance compensating nano/micro roller bearing and method for manufacturing the same

A MOEMS apparatus is provided for scanning an optical beam and a method for manufacturing it. The apparatus is formed from a double active layer silicon on insulator (DSOI) substrate that includes two active layers separated by an insulating layer, and comprises an electro-static comb drive that includes a stator formed in a first of the two active layers and a rotor formed in a second of the two active layers, and wherein the electro-static comb drive is operative to impart a tilting motion to a micro-mirror formed in the second active layer. The MOEMS apparatus is characterized in that: a) at least one of the distances created between a tooth belonging to the rotor and an adjacent tooth belonging to the stator is less than 7 μm; and the aspect ratio of the apparatus is higher than 1:20.

A moems apparatus comprising a comb drive and a method for manufacturing same

An apparatus is formed from a double active layer silicon on insulator (DSOI) substrate that includes first and second active layers separated by an insulating layer. An electrostatic comb drive is formed from the substrate to include a first comb formed from the first active layer and a second comb formed from the second active layer. The comb drive may be used to impart a tilting motion to a micro-mirror. The method of manufacturing provides comb teeth exhibiting an aspect ratio greater than 1:20, with an offset distance between comb teeth of the first and second combs that is less than about 6 μm.

MOEMS apparatus and a method for manufacturing same

A method for manufacturing a MOEMS apparatus having aligned structures in two planes

Provided is a double-sided etching method using an embedded alignment mark. The double-sided etching method includes: preparing a substrate having first and second alignment marks embedded in a middle portion thereof; etching an upper portion of the substrate so as to expose the first alignment mark from a first surface of the substrate; etching the upper portion of the substrate using the exposed first alignment mark; etching a lower portion of the substrate so as to expose the second alignment mark from a second surface of the substrate; and etching the lower portion of the substrate using the exposed second alignment mark.

Double-sided etching method using embedded alignment mark

A coil manufacturing method for a micro actuator is provided to reduce a drive current applied to a coil and power consumption by covering the upper side of a wafer except for trenches formed with the coil. A coil manufacturing method for a micro actuator comprises the steps of: preparing a substrate(100); forming a plurality of trenches for forming a coil on the upper side of the substrate; covering the upper side of the substrate except for the trenches with shielding agents(120); electro-plating conductive material to the trenches; and forming a passivation layer on the substrate.

Jeong Hyun Ku

Papers

Double-sided etching method using embedded alignment mark

Method for manufacturing coil of micro actuator

Method of etching double surfaces using embedded alignment mark