The scope of advanced semiconductor engineering (ASE) Inc. developments on microwave field including integration passive device (IPD), system-in-package (SiP), through silicon via (TSV), signal integrity(SI) and power integrity (PI) on system level, and Co-design/Co-simulation together with device modeling, integrated system analysis, measurement techniques over 60GHz, and design automatic platform have been presented. In this paper, the major development techniques at ASE will be introduced.

Ji-Han Chen

Papers

Electrical design and analysis from die level to system level in advanced semiconductor engineering group