Compared to conventional machining (CM), ultrasonic vibration-assisted machining (UVAM) with high-frequency and small-amplitude has exhibited good cutting performances for advanced materials. In recent years, advances in ultrasonic generator, ultrasonic transducer, and horn structures have led to the rapid progress in the development of UVAM. Following this trend, numerous new design requirements and theoretical concepts have been proposed and studied successively, however, very few studies have been conducted from a comprehensive perspective. To address this gap in the literature and understanding the development trend of UVAM, a critical overview of UVAM is presented in this study, covering different vibration-assisted machining styles, device architectures, and theoretical analysis. This overview covers the evolution of typical hardware systems used to achieve vibratory motions from the one-dimensional UVAM to three-dimensional UVAM, the discussion of cutting characteristics with periodic separation between the tools and workpiece and the analysis of processing properties. Challenges for UVAM include ultrasonic vibration systems with high power, large amplitude, and high efficiency, as well as theoretical research on the dynamics and cutting characteristics of UVAM. Consequently, based on the current limitations and challenges, device improvement and theoretical breakthrough play a significant role in future research on UVAM.

Review of ultrasonic vibration-assisted machining in advanced materials

Molecular dynamics study on deformation behaviour of monocrystalline GaN during nano abrasive machining

Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation

In this paper, molecular dynamics simulations are carried out to investigate the cutting mechanism during the hybrid machining process combined the thermal and vibration assistants. A modified cutting model is applied to study the material removal behavior and subsurface damage formation in one vibration cycle. The results indicate that during the hybrid machining process, the dominant material removal mechanism could transform from extrusion to shearing in a single vibration cycle. With an increase of the cutting temperature, the generation and propagation of cracks are effectively suppressed while the swelling appears when the dominant material removal mechanism becomes shearing. The formation mechanism of the subsurface damage in one vibration cycle can be distinct according to the stress distribution. Moreover, the generation of the vacancies in workpiece becomes apparent with increasing temperature, which is an important phenomenon in hybrid machining process.

/pdf/molecular-dynamics-simulation-on-cutting-mechanism-in-the-1ta9yffmlv.pdf

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Material removal mechanism and subsurface characteristics of silicon 3D nanomilling

Molecular dynamics (MD) simulation is used to study the subsurface quality and material removal of single crystal silicon with a diamond tool during ultrasonic elliptical vibration assisted cutting (UEVAC), 1D ultrasonic vibration assisted cutting (1D UVAC) and traditional cutting (TC) process. In the simulations, a long-range analytical bond order potential is used to describe the interaction inside the silicon specimen, providing a more accurate depiction of the atomic scale mechanisms of ductile plasticity, brittle fracture, and structural changes in silicon. The results show that UEVAC and 1D UVAC in cutting brittle material silicon causes a much smaller cutting force, much lower von Mises stress at the subsurface, larger material remove rate, lower compressive normal stress and and smaller shear stress In addition, the hydrostatic stress of subsurface for TC and 1D UVAC is much higher than that for UEVAC, which results in fewer Si-II and bct5-Si formed from the original Si-I in UEVAC. Moreover, the number of other atoms for UEVAC is overall smaller than those of using TC and 1D UVAC, which confirms that UEVAC produces a better subsurface. And atomic flow field analysis shows that the UEVAC tends to cut silicon in a more ductile mode. Besides, the temperature in front of tool edge and below the tool flank face of TC is much higher. This means that 1D UVAC and UEVAC have a positive effect on the tool life. However, the temperature in subsurface zone is overall larger, which reveals that 1D UVAC and UEVAC have a negative effect on the subsurface temperature.

https://iopscience.iop.org/article/10.1088/2053-1591/ab0ccb/pdf

A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation

Jingjing Chen

Papers

A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation