A vision system is provided to determine a positional relationship between a photovoltaic device wafer on a platen and a printing element, such as a printing screen, on a remote side of the photovoltaic device wafer from the platen. A source emits ultraviolet light along a path that is transverse to a longitudinal axis of an aperture through the platen, and a diffuser panel is located along that path. A reflector directs the light from the diffuser panel toward the aperture. A video camera is located along the longitudinal axis of the aperture and produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. A band-pass filter is placed in front of the camera to block ambient light. The use of diffused ultraviolet light enhances contrast in the image between the wafer and the printing element.

Machine vision technique for manufacturing semiconductor wafers

A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs ultraviolet light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition.

Direct illumination machine vision technique for processing semiconductor wafers

The position of a substrate's edge is detected using a substrate alignment system that includes, in part, a light source, an optical module adapted to receive a light emanating from the light source to form a multi-dimensional light beam; and an array sensor positioned at a focal plane of the optical module and oriented substantially perpendicular to the sample's edge. The substrate alignment system detects the substrate's edge position as soon as the substrate is loaded and placed within the capture range of the linear array sensor. As long as the substrate's edge position is within the capture range, the substrate does not have to be moved to determine its position relative to the tool's coordinate space. The capture range is substantially larger than the position accuracy required. The sensor array includes a multitude of sensors disposed along one or more rows.

Substrate alignment using linear array sensor

A method and apparatus is provided for illuminating a wafer during wafer alignment using machine vision. An illumination device is fabricated using electroluminescent material, that provides diffuse illumination uniformly over the surface of the lamp to provide backlighting of the wafer. Contrast between the image of the wafer and the diffuse illumination produce edge features in the image that can be analyzed to determine the position and orientation of the wafer.

Method and apparatus for backlighting a wafer during alignment

The invention provides, in some aspects, a wafer alignment system comprising an image acquisition device, an illumination source, a rotatable wafer platform, and an image processor that includes functionality for mapping coordinates in an image of an article (such as a wafer) on the platform to a “world” frame of reference at each of a plurality of angles of rotation of the platform.

Method and apparatus for semiconductor wafer alignment

A non-contact substrate alignment system for a lithography system is disclosed that comprises three substrate edge detectors. Each edge detector comprises a projector, preferably located above the substrate, that projects a light field down onto a substrate and a stage. The light field has a predetermined shadow line that is straight and runs perpendicularly to the direction of the substrate's edge. A camera is also located above the substrate and detects the light from the light field. The height differential between the substrate and stage causes a shift in the shadow line from the perspective of the camera. A controller connected to the camera utilizes this shift to locate the edge of the substrate. The problems associated with the mechanical banking techniques are thus avoided. Moreover, the technique uses detectors and projectors that can be located entirely above the substrate; specially designed stages with incorporated detectors or projectors are not required. The technique is also very tolerant of different types of substrates with different edge characteristics.

John D. Wallace

Papers

Non-contact edge detector