J
John F. Hulbert
Researcher at Brigham Young University
Publications - 13
Citations - 150
John F. Hulbert is an academic researcher from Brigham Young University. The author has contributed to research in topics: Electromagnetically induced transparency & Rubidium. The author has an hindex of 4, co-authored 12 publications receiving 136 citations. Previous affiliations of John F. Hulbert include University of California, Santa Cruz.
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Journal ArticleDOI
Slow light on a chip via atomic quantum state control
TL;DR: In this article, a planar planar atomic spectroscopy chip with hot rubidium atoms in hollow-core waveguides was used to demonstrate the ability to reduce the group velocity of light by a factor of 1,200.
Journal ArticleDOI
Planar Hollow-Core Waveguide Technology for Atomic Spectroscopy and Quantum Interference in Alkali Vapors
TL;DR: In this article, the authors describe the development of a hollow core waveguide technology based on the combination of vapor-filled hollow waveguides and conventional solid-core waveguiders on a silicon chip.
Journal ArticleDOI
Versatile approach to Rb vapor cell construction
TL;DR: In this article, a versatile approach to Rb atomic vapor cell construction is proposed and tested, which employs pinch-off copper cold-welds and epoxy to create hermetic seals between dissimilar geometries and materials.
Proceedings ArticleDOI
Quantum interference effects in rubidium vapor on a chip
TL;DR: In this article, both linear and nonlinear absorption spectroscopy with excellent performance are demonstrated on a chip using a self-contained Rb======€€€¯€¯¯reservoir and exhibiting a footprint of only 1.5cm x 1cm.
Journal ArticleDOI
Versatile Rb vapor cells with long lifetimes
John F. Hulbert,Matthieu Giraud-Carrier,Thomas Wall,Aaron R. Hawkins,Scott Bergeson,Jennifer A. Black,Holger Schmidt +6 more
TL;DR: In this article, an approach to the construction of long-lasting rubidium atomic vapor cells was reported, which uses pinch-off copper cold-welds, low temperature solders, and electroplated copper to create longlasting hermetic seals between containment chambers of dissimilar geometries and materials.