An interference modulator (Imod) incorporates anti-reflection coatings and/or micro-fabricated supplemental lighting sources. An efficient drive scheme is provided for matrix addressed arrays of IMods or other micromechanical devices. An improved color scheme provides greater flexibility. Electronic hardware can be field reconfigured to accommodate different display formats and/or application functions. An IMod's electromechanical behavior can be decoupled from its optical behavior. An improved actuation means is provided, some one of which may be hidden from view. An IMod or IMod array is fabricated and used in conjunction with a MEMS switch or switch array. An IMod can be used for optical switching and modulation. Some IMods incorporate 2-D and 3-D photonic structures. A variety of applications for the modulation of light are discussed. A MEMS manufacturing and packaging approach is provided based on a continuous web fed process. IMods can be used as test structures for the evaluation of residual stress in deposited materials.

Photonic mems and structures

An interferometric modulator manufactured according to a particular set of processing parameters may have a non-zero offset voltage. A process has been developed for modifying the processing parameters to shift the non-zero offset voltage closer to zero. For example, the process may involve identifying a set of processing parameters for manufacturing an interferometric modulator that results in a non-zero offset voltage for the interferometric modulator. The set of processing parameters may then be modified to shift the non-zero offset voltage closer to zero. For example, modifying the set of processing parameters may involve modifying one or more deposition parameters used to make the interferometric modulator, applying a current (e.g., a counteracting current) to the interferometric modulator, and/or annealing the interferometric modulator. Interferometric modulators made according to the set of modified processing parameters may have improved performance and/or simpler drive schemes.

Process for modifying offset voltage characteristics of an interferometric modulator

A light modulator has one or more gratings and one or more MEMS actuators operable to move the gratings for selectively modulating light from an input light source. Certain embodiments have a plurality of blazed gratings arranged parallel to a plane and movable linearly parallel to the plane by MEMS actuators. Each of the gratings is individually blazed for light of a selected color such as red, green or blue. Associated with the gratings may be portions providing black and/or white outputs. An aperture spaced apart from the plane allows color(s) selected from an input white-light source to be directed to an output. An array of MEMS-actuated modulation devices provides a color spatial light modulator. Other embodiments have a grating adapted to be tilted by a MEMS actuator, either continuously through a range of angles or to a selected angle of a set of predetermined discrete angles, to direct selected wavelengths diffracted by the grating toward collection optics for a modulated light output. Methods specially adapted for making and using such light modulators are disclosed.

MEMS-actuated color light modulator and methods

One embodiment is directed to a gimbal mechanism for a MEMS mirror device having folded flexure hinges. Another embodiment is directed to a gimbal mechanism having a frame with through-holes or recesses distributed thereabout to reduce weight of said frame. Other embodiments are directed to improved electrode structures for electrostatically actuated MEMS devices. Other embodiments are directed to methods for fabricating electrodes for electrostatically actuated MEMS devices. Other embodiments are directed to methods of fabricating through-wafer interconnect devices. Other embodiments are directed to MEMS mirror array packaging. Other embodiments are directed to electrostatically actuated MEMS devices having driver circuits integrated therewith. Other embodiments are directed to methods of patterning wafers with a plurality of through-holes. Other embodiments are directed to methods of forming moveable structures in MEMS devices. Other embodiments are directed to methods of depositing a thin film on the back of a MEMS device.

Electrostatically actuated micro-electro-mechanical devices and method of manufacture

An optical-interference type display panel and a method for making the same are disclosed, wherein the display panel has a substrate on which multiple first conductive optical film stacks, supporting layers and multiple second conductive optical film stacks are formed. The substrate further has a plurality of connecting pads consisting of a transparent conductive film of the first conductive optical film stacks. Since the transparent conductive film is made of indium tin oxide, these connecting pads have the excellent anti-oxidation ability at their surface.

Optical-interference type display panel and method for making the same

An optical mirror system with multi-axis rotational control is disclosed The mirror system includes an optical surface assembly, and at least one leg assembly coupled to the optical surface assembly The at least one leg assembly supports the optical surface above a substrate A system and method in accordance with the present invention can operate with many different actuator mechanisms, including but not limited to, electrostatic, thermal, piezoelectric, and magnetic An optical mirror system in accordance with the present invention accommodates large mirrors and rotation angles Scanning mirrors can be made with this technique using standard surface-micromachining processes, or a deep RIE etch process A device in accordance with the present invention meets the requirements for a directly scalable, high port count optical switch, utilizing a two mirror per optical I/O port configuration An optical mirror in accordance with the present invention can be utilized in, but is not limited to, the following applications: optical add-drop multiplexers, wavelength routers, free-space optical interconnects, chip-level optical I/O, optical scanning displays, optical scanner (bar-codes, micro cameras), optical storage read/write heads, laser printers, medical replacement for glasses (incorporated with adaptive optics), medical diagnostic equipment, optical scanning for security applications

John J. Fling

Papers

Optical mirror system with multi-axis rotational control