Conductive thick film pigment-coated surfaces which possess desirable conductivity and solderability characteristics are formed from an alloy comprising a mixture of a nonnoble conductive metal, a noble metal and at least one oxidizable material. The oxidizable material is present in the alloy in an amount in the range of from about 5% to about 25% by weight, the nonnoble metal in an amount in the range of from about 94% to about 60% by weight and the noble metal in an amount in the range of from about 1% to about 15% by weight of the alloy. The desired product is prepared by admixing a nonnoble metal, an oxidizable material and a noble metal, arc-melting the mixture to form an alloy, grinding the arc-melted alloy to a powdered form, admixing the powder with the carrier binder, depositing said admixture on an inert surface, firing the admixture and surface in an oxygen-containing atmosphere at a temperature in the range of from about 500° to about 950° C. and fluxing the resultant conductive thick film pigment-coated surface with a zinc-chloride based flux to provide the desired product.

Conductive pigment-coated surfaces

A high stress corrosion resistant metallized capacitor is disclosed having at least one electrode consisting of a metallic bilayer vapor deposited on a dielectric strip. In a preferred embodiment, a layer of aluminum is covered by a second metal layer which is between about 1/6 to 1/12 the thickness of the aluminum layer and is continuous throughout. The aluminum layer extends beyond the second layer in a marginal area.

Metallized capacitor with improved bilayer electrodes

Gold-containing preparations which improve the adhesiveness, guarantee an esthetic appearance, and should make possible a saving in gold consumption are needed for the production of intermediate layers for the facings of fired on alloys in the dental art with ceramic compositions. This is accomplished with preparation that contain 50 to 94% gold powder having a particle size <30μ, 5-40% binder made of organic solvent and resin components are 1-20% of a metal powder whose particle size is greater than of the gold powder used and whose melting temperature is above that of gold.

Gold containing preparation for coating metallic parts

Capacitor structure capable of achieving increased energy storage density is disclosed together with a fabrication sequence for the capacitor and its anodic oxide dielectric material. Soft porous aluminum oxide which has been formed in a first anodization step and has been densified or transformed to hard barrier oxide in a second anodization step is preferred for the capacitor dielectric material. The first anodization may be performed in a sulfuric acid electrolyte while the second anodization may be performed in a boric acid electrolyte. The boric acid may be diluted with ethylene glycol. The disclosed capacitor is fabricated on a silicon wafer substrate.

Capacitor method for improved oxide dielectric

A monolithic ceramic capacitor having fritless electrodes of nickel or other base metal particles coated with a precious metal such as platinum. The coating may be very thin and typically applied by electroless plating and/or electroplating. The particles may be used as the sole pigment for the electrodes or the particles may be mixed with other compatible pigments.

Monolithic ceramic capacitor

Metallizations for formation of conductors on substrates, comprising (1) nickel or nickel-containing base metal alloys, and (2) noble metals, e.g., palladium, palladium/gold, platinum/palladium/gold, and palladium/silver, wherein the ratio of nickel or nickel-containing alloy to noble metal is up to 1/1 (by weight). The metallization are used as conductors on ceramic substrates and for ceramic capacitors.

John Leo Sheard

Papers

Capacitors with nickel containing electrodes