A tile subarray includes an upper multi-layer assembly (UMLA) provided from a first plurality of printed circuit boards and a lower multi-layer assembly (LMLA) provided from a second plurality of printed circuit boards Each of the UMLA and LMLA includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the UMLA and LMLA The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the UMLA and LMLA

Tile sub-array and related circuits and techniques

Systems and methods for wireless power transmission

The present disclosure describes a methodology for wireless power transmission based on pocket-forming. This methodology may include one transmitter and at least one or more receivers, being the transmitter the source of energy and the receiver the device that is desired to charge or power. The transmitter may identify and locate the device to which the receiver is connected and thereafter aim pockets of energy to the device in order to power it. Pockets of energy may be generated through constructive and destructive interferences, which may create null-spaces and spots of pockets of energy ranged into one or more radii from transmitter. Such feature may enable wireless power transmission through a selective range, which may limit operation area of electronic devices and/or may avoid formation of pockets of energy near and/or over certain areas, objects and people.

Wireless power transmission with selective range

A method for controlling communication between wireless power transmitter managers is disclosed. According to some aspects of this embodiment, wireless power transmission system may include one or more wireless power transmitter managers and one or more wireless power receivers for powering various customer devices. A WiFi connection may be established between wireless power transmitter managers to share information between system devices. Wireless power transmitter manager may need to fulfill two conditions to control power transfer over a customer device; customer device's signal strength threshold has to be significantly greater than 50%, such as 55% or more of the signal strength measured by all other wireless power transmitter managers and has to remain significantly greater than 50% for a minimum amount of time.

System and method for controlling communication between wireless power transmitter managers

The present invention may provide various electric receiver arrangements which may be used to provide wireless power transmission using suitable power transmission techniques such as pocket-forming. In some embodiments, receivers may include at least one antenna connected to at least one rectifier and one power converter. In other embodiments, receivers including a plurality of antennas, a plurality of rectifiers or a plurality of power converters may be provided. In addition, receivers may include communications components which may allow for communication to various electronic equipment including transmitters, phones, computers and others. Lastly, various implementation arrangements may be provided for including receivers in electronic devices.

Receivers for Wireless Power Transmission

A planar circulator assembly includes a dielectric substrate having a first surface and an opposing second surface, a plurality of circulator circuits, each circulator circuit having a first ferrite receiving pad disposed on the first surface and a second ferrite receiving pad; disposed on the second surface a first sub-assembly board disposed on the first surface having a plurality of first apertures, a plurality of ferrite-magnet sub-assemblies, each ferrite-magnet sub-assembly disposed in a corresponding first aperture and aligned with a corresponding first ferrite receiving pad and electromagnetically coupled to the corresponding first ferrite receiving pad. The assembly further includes a second sub-assembly board disposed on the second surface having a plurality of second apertures, and a plurality of ferrites, each ferrite disposed in a corresponding second aperture and aligned with a corresponding second ferrite receiving pad and electromagnetically coupled to the corresponding second ferrite receiving pad.

Embedded planar circulator

A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Radio frequency interconnect circuits and techniques

A multi-layer stripline assembly interconnection includes a first stripline sub-assembly having a first surface and a first plurality of vias disposed in the first surface adapted to receive a plurality of solid metal balls. The interconnection further includes a second stripline sub-assembly having a second plurality of vias disposed in the first surface of the second sub-assembly adapted to be aligned with the first plurality of vias. Reflowed solder is wetted to the second plurality of vias and to the corresponding plurality of solid metal balls.

Joseph M Crowder

Papers

Tile sub-array and related circuits and techniques

Embedded planar circulator

Radio frequency interconnect circuits and techniques

Multilayer stripline radio frequency circuits and interconnection methods

Embedded planar circulator and a method for fabricating the same