A heat sink assembly (10) adapted for use with an electronic device package (24) such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base (34) of a finned heat sink (28) adapted to be received in a threaded bore (26) of an adaptor (12) which mounts onto the electronic device package (24). Desired thermal coupling is achieved by screwing down the heat sink (28) in biasing engagement with the package (24). Alternate embodiments show the heat sink (28) which has a snap on flange (20, 22) to attach the heat sink (28) to the adaptor (12) and the adaptor extending down to engage with the socket (60) in which the electronic device package (24) is installed.

Heat sink assembly for solid state devices

A tapered slot antenna (20) includes a dielectric (22) with a metallization layer (24) deposited on one side. The metallization layer (24) is etched to the dielectric substrate (22) to form a tapered slot (26, 28, 30, 32). In order to tune the antenna 20), for example, such that the E and H field beam width are symmetrical, the (22) extends beyond the wide portion of the slot as a dielectric loading (26, 28, 30, 32). A microstrip feed line (40, 42, 44, 46) is formed by a metallization deposit on an opposing side of the substrate (22). The microstrip feed line (40, 42, 44, 46) extends across a narrow portion of the tapered slot (26, 28, 30, 32) and is configured to optimize the coupling between the microstrip feed line (40, 42, 44, 46) and the tapered slot antenna (20).

Extended dielectric material tapered slot antenna

A heat sink (60) having one or more cooling fins (64) along a central shaft (66) is securable to an active device substrate (12) by a spring clip (80) whose latch sections (92) are latched under latch projections (44) on side walls (40) of the housing (30) to which the substrate (12) is mounted. The bow-shaped formed wire spring clip (80) has arcuate inner sections (82) disposed against the central shaft (66) of the heat sink (60) and exerts spring force downwardly on a retention fin (68) of the heat sink (60) when latched to the housing (30), which holds the bottom surface (62) of the heat sink (60) against the top substrate surface (22) to create a thermal connection.

Retention system for removable heat sink

A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region and installed in a socket, is provided. A clip member is provided with a central female-threaded bore. A collar, having outer male threads and inner female threads is threadably receivable within the bore of the clip member. The collar is threaded down into the bore to communicate with an upper surface of the ceramic portion of a semiconductor device at a first pressure which is high enough to maintain the package in electrical communication with its socket. A heat dissipating member, having a male-threaded base, is threadably installed into the female-threaded bore of the collar to engage the upper surface of the silicon portion of the semiconductor package. The pressure of the heat dissipating member onto the silicon portion of the package is independently adjustable relative to the pressure of the collar onto the ceramic portion of the semiconductor package. As a result, the multiple pressure requirements of the semiconductor package can be accommodated in a single heat dissipating device.

Heat sink assembly with threaded collar and multiple pressure capability

A radial fin heat sink (1) whereby a spreader plate (2) supports a series of radial fins (5) which are staggered around a central open cylindrical area (8) designed to receive a flow of air by impingement. The radial fins comprise a pattern of variable lengths which follow in succession from a major length to a minor length to an intermediate length which pattern repeats around the periphery of the spreader plate.

Staggered radial-fin heat sink device for integrated circuit package

A heat exchange attachment device for integrated circuits is presented which eliminates any need for contact with adhesive pastes or solder. A snap-on holding piece permits a finned cooling unit to be threaded through an aluminum base plate attached to the pin grid array package so that a threaded shaft of the cooling unit may be screwed into adjustable contact with a beryllium oxide disk mounted on the integrated circuit package.

Jr. John Weaver Mitchell

Papers

Heat sink for integrated circuit package