A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Through-wafer interconnects for photoimager and memory wafers

Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microelectronic substrate, an integrated circuit, and an image sensor electrically coupled to the integrated circuit. A bond-pad is carried by the substrate and electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the substrate and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad, a dielectric liner deposited into the passage and in contact with the substrate, first and second conductive layers deposited onto at least a portion of the dielectric liner, and a conductive fill material deposited into the passage over at least a portion of the second conductive layer and electrically coupled to the bond-pad.

Packaged microelectronic imagers and methods of packaging microelectronic imagers

An IC chip package for an image sensitive, integrated circuit semiconductor die incorporates all the components typically found in an imaging module of an electronic camera. The IC chip package (80) consists of a plastic substrate base (83) for holding an image sensor die and a separate, plastic upper cover (81) for encapsulating the image sensor die and holding a filter glass (87), an optical lens (89), and providing an aperture for the optical lens. The upper cover (81) has a lower shelf (109) for holding the optical lens (89) in alignment with the aperture opening over the image sensor die, and has an upper shelf (107) for holding the filter glass (87) over the optical lens (89). The lens is attached to the lower shelf using UV cure adhesive, and its focal distance to the image sensor die is determined by first electrically activating the image sensor die, adjusting the lens position to identify the optimal focus sharpness, and then applying UV light to activate the UV cure adhesive and hold the lens in focus.

Integrated ic chip package for electronic image sensor die

Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includes a plurality of individual substrates integrally connected together in an array format. Image sensors are attached and electrically connected to corresponding individual substrates. An adhesive layer attaches the molded window array to the substrate. The substrate and attached molded window array are singulated into a plurality of individual image sensor packages.

Molded window array for image sensor packages

Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imaging die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.

Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers

An image head assembly comprising: a substrate with at least a pair of apertures formed in the substrate; an optical assembly having at least a pair of pins that mate with the apertures within the substrate, the pins to the optical assembly being fixedly secured to the apertures within the substrate; an image sensor located between the apertures covered by a cover glass above the image sensor on the optical assembly; interface means for providing an electrical connection between the substrate and the image sensor; a lens system mounted on top the cover glass; and a single element blur filter contained within the lens system. The assembly contains a single element blur filter such as a cross-pleated blur filter. The lens system is prevented from being a reverse telephoto lens system with use of a blur filter that does not require a large back focus and is instead a telephoto lens system.

Imager package substrate

PROBLEM TO BE SOLVED: To provide an image head assembly for reducing size, interface and cost by actively aligning it in a package without the use of an alignment plate. SOLUTION: This image head assembly comprises a base plate 10 having at least a pair of openings formed in a plate 10, an optical assembly unit having at least a pair of pins fixed snugly and engaged with the openings in the base 10, an image sensor 32 disposed between the openings covered with a cover glass 25 on the sensor 32 on the assembly unit, an interface means for giving an electrical connection between the base 10 and the sensor 32, a lens system placed on the glass 25, and a single element blurring filter contained in the lens system. The assembly unit includes a single element blurring filter, such as a cross pleating type blurring filter. The lens system is not be necessarily an inverted telephoto lens system by using the blurring filter which does not need back focus, but instead way be a telephoto lens system.

Julie K. Gerstenberger

Papers

Imager package substrate

Image head assembly