A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region The semiconductive layer is provided in the second region

Wired circuit board

There is provided an electrically heated aerosol generating system for receiving an aerosol-forming substrate. The system comprises at least one heating element (309) for heating the substrate to form the aerosol and a power supply (301) for supplying power to the at least one heating element. The power supply comprises a voltage source (303), two or more supercapacitors (305, 307), and switches (51, 52, 53, 54, 55) between the voltage source and the two or more supercapacitors. The switches are arranged such that, during a charging mode, the two or more supercapacitors are connected, at least partially, in parallel with each other, for charging by the voltage source and, during a heating mode, the two or more supercapacitors are connected in series with each other, for discharging through the at least one heating element.

Electrically heated aerosol generating system and method

Printed circuit board

The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.

Printed circuit board and manufacturing method thereof

A suspension board with circuit includes an insulating base layer and a conductive pattern that is laminated on a top surface of the insulating base layer. The conductive pattern includes a wire and a terminal portion that is connected to the wire for being joined by a melted metal. The insulating base layer, in a projected surface when projected in a laminating direction, includes an adjacent region that is adjacent to the terminal portion and a separated region that is separated from the terminal portion so as to sandwich the adjacent region with the terminal portion. The adjacent region is formed to be thinner than the separated region.

Suspension board with circuit

A suspension board with circuit includes a metal supporting board; an insulating base layer formed on the metal supporting board; a conductive pattern formed on the insulating base layer; an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern; and an optical waveguide. The optical waveguide is adhered on the metal supporting board, the insulating base layer, or the insulating cover layer.

Suspension board with circuit and producing method thereof

A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 µm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.

Wired circuit board and production method thereof

A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface.

Wired circuit board and connection structure between wired circuit boards

A producing method of a wired circuit board includes the steps of preparing a wired circuit board having an insulating layer and a conductive pattern including a wire covered with the insulating layer and a terminal portion exposed from the insulating layer, disposing a contact member formed of a material having a standard electrode potential lower than that of a conductive material forming the conductive pattern such that the contact member is in contact with the conductive pattern and exposed from the insulating layer, and dipping the wired circuit board including the disposed contact member in a polymerization solution of a conductive polymer to form a semiconductive layer on the surface of the insulating layer.

Jun Ishii

Papers

Wired circuit board

Suspension board with circuit and producing method thereof

Wired circuit board and production method thereof

Wired circuit board and connection structure between wired circuit boards

Producing method of wired circuit board