Method for preparing tin-copper alloy materials and carbon covered tin-copper alloy materials

The invention discloses an impregnation liquid special for a lead-calcium alloyed grid, which comprises, by weight, 5-10% of phosphoric acid, 10% of antimonous oxide, 7-12% of zinc oxide, 5-15% of aluminum sesquioxide, 5-8% of ammonium bicarbonate, 3-5% of cerium hydroxide, 7-15% of tin oxide, and the balance of water. According to the technical scheme, technical operation is simple, formation of a high-resistance layer (CaSO4 crystal) on an active material interface during use of positive grids can be avoided greatly, deep cycle performance of a lead-calcium alloy battery can be improved, and the defect that early capacity loss of a VRLA (valve regulated lead acid) lead-calcium alloy battery is overcome. The battery made of the lead-calcium alloyed grid has no acid gas leakage, is fine in sealing performance, lower in gassing quantity and lower in self-discharge, and has advantages of both the lead-calsium battery and the lead-antimony-cadmium alloy battery, electrical property of an anode film of the grid is improved to the maximum extent, and deep-cycle durability of the lead-acid battery is improved.

Impregnation liquid special for lead-calcium alloyed grid

The invention relates to tinning copper clad aluminum wire production technology. The tinning copper clad aluminum wire production technology comprises the following steps in order: employing cladding welding technology to making a copper clad aluminum rod, drawing, carrying out copper clad aluminum wire processing before electrodeposition, washing, carrying out electrodeposition tinning, second washing, carrying out alkaline neutralization, washing with hot water, drying and polishing. The tinning copper clad aluminum wire production technology has the following advantages that: accurate control of thickness of a tin coating, a uniform tin layer thickness, good concentricity, and good bonding force between the tin layer and a copper layer at a copper clad aluminum external surface.

Tinning copper clad aluminum wire production technology

The invention provides a chemically-tinned copper wire and a preparation method thereof. The tinned layer thickness can be adjusted by controlling the chemical tinning time and chemical plating solution proportion. A chemical plating solution is composed of a tin salt solution, a coordination agent, a reducing agent, a surface active agent and an antioxidant. The tin salt solution is a SnCl2 solution with the concentration being 30-35g/L; the coordination agent is thiourea with the concentration being 80-120g/L or methanesulfonic acid with the concentration being 5-8g/L; and the reducing agent is NaH2PO2.H2O with the concentration being 60-100g/L. Therefore, the tinned layer thickness and uniformity are effectively guaranteed, and the prepared tinned copper wire has good oxidation resistance, electric conductivity and weldability.

Chemically-tinned copper wire and preparation method thereof

Methods of treating of stannous oxide particles having at least a partial surface crust of stannic oxide by contacting the particles with a reducing agent for a period of time sufficient to produce stannous oxide are provided. The stannous oxide particles produced are readily soluble in organic sulfonic acids.

Process for treating crusty SnO

The invention discloses new semi-bright lead-free chemical tinning liquid and a using method thereof. A semi-bright silver tin-copper alloy chemical plating layer is obtained on copper and copper alloy matrix. In the chemical plating liquid, tin sulfate is used as a main salt, thiourea is used as a main complexing agent, citric acid is used as an auxiliary complexing agent, sodium hypophosphite is used as a reducing agent, ethylene diamine tetraacetic acid is used as an antioxidant, sulfuric acid is used as a stabilizing agent, gelatin is used as a leveling agent, and benzaldehyde is used as an auxiliary brightening agent. The pH value of the plating liquid is 0.8 to 2.0, the temperature of the plating liquid is between 80 and 90 DEG C, the carrying capacity of the plating liquid is 0.8 to 1.5dm2/L, and the mechanical stirring speed is 50 to 100 rpm. The continuous self-catalytic deposition of tin is implemented on the copper and copper alloy matrix, plating layers of different thicknesses can be obtained by controlling the chemical plating time, and the deposition speed is high; crystalline grains are obviously refined, the surface flatness of the plating layer is improved, and the plating surface area is large; the plating layer and the matrix are combined firmly; and after passivating treatment, the change resistance of the plating layer is high. The technology has broad application prospect in products such as deep hole pieces, blind hole pieces, small-sized electronic parts and components which are difficult to process, printed circuit boards (PCB) and the like.

Junli Wang

Papers

Semi-bright lead-free chemical tinning liquid and using method thereof