A fast-Fourier-transform method of topography and interferometry is proposed. By computer processing of a noncontour type of fringe pattern, automatic discrimination is achieved between elevation and depression of the object or wave-front form, which has not been possible by the fringe-contour-generation techniques. The method has advantages over moire topography and conventional fringe-contour interferometry in both accuracy and sensitivity. Unlike fringe-scanning techniques, the method is easy to apply because it uses no moving components.

Fourier-transform method of fringe-pattern analysis for computer-based topography and interferometry

Interpretation of X-ray Powder Diffraction Patterns . By H. Lipson and H. Steeple. Pp. viii + 335 + 3 plates. (Mac-millan: London; St Martins Press: New York, May 1970.) £4.

X-Ray Diffraction

Wire Arc Additive Manufacturing (WAAM) is attracting significant attention in industry and academia due to its ability to capture the benefits of additive manufacturing for production of large components of medium geometric complexity. Uniquely, WAAM combines the use of wire and electric arc as a fusion source to build components in a layer-by-layer approach, both of which can offer significant cost savings compared to powder and alternative fusion sources, such as laser and electron beam, respectively. Meanwhile, a high deposition rate, key for producing such components, is provided, whilst also allowing significant material savings compared to conventional manufacturing processes. However, high quality production in a wide range of materials is limited by the elevated levels of heat input which causes a number of materials processing challenges in WAAM. The materials processing challenges are fully identified in this paper to include the development of high residual stresses, undesirable microstructures, and solute segregation and phase transformations at solidification. The thermal profile during the build poses another challenge leading to heterogeneous and anisotropic material properties. This paper outlines how the materials processing challenges may be addressed in WAAM by implementation of quality improving ancillary processes. The primary WAAM process selections and ancillary processes are classified by the authors and a comprehensive review of their application conducted. Strategies by which the ancillary processes can enhance the quality of WAAM parts are presented. The efficacy and suitability of these strategies for versatile and cost effective WAAM production are discussed and a future vision of WAAM process developments provided.

https://purehost.bath.ac.uk/ws/files/183236429/StrategiesAndProcessesForHighQualityWireArcAdditiveManufacturing_Manuscript.pdf

Invited review article: Strategies and processes for high quality wire arc additive manufacturing

The projection of the eigenfunctions obtained in standard plane-wave first-principle electronic-structure calculations into atomic-orbital basis sets is proposed as a formal and practical link between the methods based on plane waves and the ones based on atomic orbitals. Given a candidate atomic basis, ({\it i}) its quality is evaluated by its projection into the plane-wave eigenfunctions, ({\it ii}) it is optimized by maximizing that projection, ({\it iii}) the associated tight-binding Hamiltonian and energy bands are obtained, and ({\it iv}) population analysis is performed in a natural way. The proposed method replaces the traditional trial-and-error procedures of finding appropriate atomic bases and the fitting of bands to obtain tight-binding Hamiltonians. Test calculations of some zincblende semiconductors are presented.

https://arxiv.org/pdf/cond-mat/9505075.pdf

Projection of plane-wave calculations into atomic orbitals

The objective of this review is to study the effect of minor alloying and impurity elements, typically present in electronics manufacturing environment, on the interfacial reactions between Sn and Cu, which is the base system for Pb-free soldering. Especially, the reasons leading to the observed interfacial reaction layers and their microstructural evolution are analysed. The following conclusions have been reached. Alloying and impurity elements can have three major effects on the reactions between the Sn-based solder and the conductor metal: Firstly, they can increase or decrease the reaction/growth rate. Secondly, additives can change the physical properties of the phases formed (in the case of Cu and Sn, ɛ and η). Thirdly they can form additional reaction layers at the interface or they can displace the binary phases that would normally appear and form other reaction products instead. Further, the alloying and impurity elements can be divided roughly into two major categories: (i) elements (Ni, Au, Sb, In, Co, Pt, Pd, and Zn) that show marked solubility in the intermetallic compound (IMC) layer (generally take part in the interfacial reaction in question) and (ii) elements (Bi, Ag, Fe, Al, P, rare-earth elements, Ti and S) that are not extensively soluble in IMC layer (only change the activities of species taking part in the interfacial reaction and do not usually participate themselves). The elements belonging to category (i) usually have the most pronounced effect on IMC formation. It is also shown that by adding appropriate amounts of certain alloying elements to Sn-based solder, it is possible to tailor the properties of the interfacial compounds to exhibit, for example, better drop test reliability. Further, it is demonstrated that if excess amount of the same alloying elements are used, drastic decrease in reliability can occur. The analysis for this behaviour is based on the so-called thermodynamic–kinetic method.

Junmei Chen

Papers

First-principles investigation of the structural and electronic properties of Cu6−xNixSn5 (x = 0, 1, 2) intermetallic compounds

Effect of laser remelting processing on microstructure and mechanical properties of 17-4 PH stainless steel during laser direct metal deposition

Reduction of ductility-dip cracking susceptibility by ultrasonic-assisted GTAW

Comparison of residual stress induced by TIG and LBW in girth weld of AISI 304 stainless steel pipes

Ab initio calculation of the properties and pressure induced transition of Sn