Novel heat dissipation design incorporating heat pipes for DC combiner boxes of a PV system

In this study, to deal with multi-heat-source and high-heat-flux heat transfer problem in confined space within electronic equipments, cold plate equipment employing heat pipe technology has been designed. Acetone-aluminum heat pipe construction composed of 8 vertical pipes with their upper condensation section and lower evaporation section connected to let working liquid and vapor flow through each other when equipment works. Evaporation section of connective heat pipe construction is embedded in aluminum-made cold plate and cooling water flowing through water jacket cools condensation section of construction. Electronic-heating heat sources (16) are evenly arranged on two bigger vertical surfaces of cold plate to simulate heat generation of real array antennas and heat is eventually transferred to cooling water and then to outer environment. Heat pipe cold plate equipment has been formed and possesses excellent heat-transfer performance, startup performance and temperature evenness and can solve high heat-flux problem determining working reliability of array antennas effectively.

http://nopr.niscair.res.in/bitstream/123456789/6131/1/JSIR%2068%2810%29%20861-865.pdf

Experimental investigation of a novel heat pipe cold plate for electronics cooling

In this study, simulations are made to resolve a 100 W heat dissipating capacity of a portable PC in (with a CPU IHS size of 31 mm × 31 mm). The problem is investigated via a commercially available software (Icepak version 4.1). The present design incorporates heat pipe to convey heat from the hot spot towards the heat sinks. The heat sinks are optimized subject to heat loads and their locations. The calculated results of a double heat sinks design show a 30 °C less temperature when compared to a single heat sink module. This is because double heat sinks design provides much more uniform temperature and eliminates the edge effect. Moreover, the effect of fin pitches is also examined in this study. It is found that the best performance is at a fin thickness of 0.2 mm and at a fin pitch of 2.4 mm. Depending on the optimal parameters of the thermal module, the chip temperature can be reduced to approximately 75 °C.© 2005 ASME

Thermal Management of a Notebook Computer

Recently the heat generation rate of electronic devices continues to increase, reaching as high as 100 W for CPUs in desktop PCs. Since conventional cooling methods are coming close to performance limits due to the restriction as to the outer dimensions allowed for heatsinks, there is a need for new cooling methods focusing on high-heat generating devices —in excess of 100 W. Accordingly, we have investigated the applicability of a new heatpipe-based remote heatsink (HP-RHS), where heatsinks with a sufficient heat-dissipating area are installed in an open space, and the heat is transferred there using heatpipes. The experimental results show that, using an HP-RHS with a 120-mm square fan, a heat rate of up to some 150 W can be dissipated adequately while keeping the temperature difference between the CPU case and the ambient below 30°C. This paper describes the successful development of such a good heatsink, which is capable of cooling over-100W heat-generating devices offering practicality together with silent operation.

/pdf/development-of-heatpipe-based-remote-heatsinks-for-desktop-371ptfrbx4.pdf

Development of Heatpipe-Based Remote Heatsinks for Desktop PCs

Numerical simulation of heat transfer and two-phase flow in a novel heat pipe cold plate

This paper reports on the performance of miniature heat-pipes developed for the cooling of electronic equipment and on evaluation of the notebook computer cooling systems in which they are used. Experiments for the miniature heat-pipes were conducted on their thermal properties and reliability. The results indicate that the miniature heat-pipe can be applied to electronic equipment cooling, and evaluation tests of the cooling system using this miniature heat-pipe have clarified the effectiveness of the miniature heat-pipe.

http://ieeexplore.ieee.org/iel5/6144/18032/00833047.pdf

K. Namba

Papers

Heat-pipes for electronic devices cooling and evaluation of their thermal performance