Disclosed is a phase change ink comprising (a) a colorant and (b) a phase change ink carrier, said carrier comprising (i) a branched triamide and (ii) a polyethylene wax having an average peak molecular weight of from about 350 to about 730 and a polydispersity of from about 1.0001 to about 1.500. Also disclosed is a process which comprises (1) incorporating into an ink jet printing apparatus a phase change ink comprising (a) a colorant and (b) a phase change ink carrier, said carrier comprising (i) a branched triamide and (ii) a polyethylene wax having an average peak molecular weight of from about 350 to about 730 and a polydispersity of from about 1.0001 to about 1.500; (2) melting the ink; and (3) causing droplets of the melted ink to be ejected in an imagewise pattern onto a substrate.

Phase change inks

In the lithographic multilayer resist process, a material comprising a copolymer of a hydroxy-containing vinylnaphthalene with hydroxy-free olefins is useful in forming a resist undercoat. The undercoat-forming material has a high transparency and optimum values of n and k so that it functions as an antireflective coating during short-wavelength exposure, and has etching resistance during substrate processing by etching.

Photoresist undercoat-forming material and patterning process

There is provided a photosensitive resin composition comprising:
 (a) 100 parts by weight of a polyorganosiloxane obtained by a method of combining at least one silanol compound represented by the following formula (1): R 1 2 Si(OH) 2   (1) {the groups in the formula being defined in the claims}, at least one alkoxysilane compound represented by the following formula (2): R 2 a R 3 b Si(OR 4 ) 4-a-b   (2) {the groups in the formula being defined in the claims} and a catalyst, and polymerizing them without active addition of water;
 (b) 1-50 parts by weight of a photopolymerization initiator; (c) 40-600 parts by weight of a fluorene compound represented by the following formula (3): {the groups in the formula being defined in the claims}; and
 (d) 20-300 parts by weight of a compound other than component (c), having one or two (meth)acryloyl groups in the molecule

Photosensitive resin composition

Disclosed is a positive photosensitive insulating resin composition characterized by containing a copolymer (A) composed of 10-99 mol% of a structural unit (A1) represented by the general formula (1) below and 90-1 mol% of a structural unit (A2) represented by the general formula (2) below; a compound (B) having a quinonediazide group; at least one compound (C) selected from the group consisting of aromatic compounds (C1) containing a methylol group and/or an alkoxymethyl group (excluding aromatic compounds containing an amino group), aromatic aldehyde compounds (C2), aliphatic aldehyde compounds (C3), alkyl etherified amino group-containing compounds (C4) and epoxy group-containing compounds (C5); a solvent (D); and an adhesion improver (E). Also disclosed is a cured product of such a positive photosensitive insulating resin composition. (In the formulae, Ra and Rc respectively represent an alkyl group having 1-4 carbon atoms, an alkoxy group or an aryl group; Rb and Rd respectively represent a hydrogen atom or a methyl group; n represents an integer of 0-3; and m represents an integer of 1-3.) The cured product is excellent in various characteristics such as resolution, electrical insulation, thermal shock resistance and adhesiveness.

Positive photosensitive insulating resin composition and cured product thereof

A disperse dye mixture comprising dye (I) and dye (II) blended at a ratio of from 0.1 to 10 times by weight of dye (II) to dye (I): ##STR1## wherein X is halogen, nitro, cyano, thiocyanate, methylsulfonyl, C1 or C2 alkylcarbonyl, C1 -C4 alkoxycarbonyl or vinylsulfonyl, Y is hydrogen, halogen, cyano, trifluoromethyl or methylsulfonyl, W is hydrogen, halogen, C1 or C2 alkyl or C1 or C2 alkoxy, and each of R1 and R2 which are independent of each other, is hydrogen, C1 --C8 alkyl, or C2 -C4 alkyl substituted by halogen, hydroxyl, cyano, alkoxy, alkoxyalkoxy, a hydroxyalkoxy, hydroxyalkoxyalkoxy, acyloxyalkoxy or acyloxyalkoxyalkoxy, provided that each alkoxy has from 1 to 4 carbon atoms.

Disperse dye mixture.

NEW MATERIAL:Compounds represented by the formula, wherein X and Y are each nitro or hydroxy; R and R are each an alkyl; and R , R and R are each H or an alkyl. USE:Blue dyes for a filter, which have excellent resistance to light and heat. Examples of substrates which can be colored with the dyes are thermoplastic resins (e.g., polystyrene, polyethylene, acrylic resins, or polycarbonates), thermosetting resins (e.g., amino resins, phenolic resin, polyurethanes, or polycarbonates), alumina film (supported by glass or a resin) and silica film (supported by glass or a resin). THe coloring of these materials can be made by incorporation, transfer, dyeing, sublimation deposition, etc. PREPARATION:Dinitrodihydroxyanthraquinone or tetrahydroxyanthraquinone and its leuco compd. are reacted with an aniline derivative to obtain the desired compd.

Blue dye for filter

PROBLEM TO BE SOLVED: To obtain the subject resin which has a specific chemical structure and is very useful as a component for solder resists because of high hardness, moisture resistance, thermal resistance, and chemical resistance of the films after being cured as well as of high developability. SOLUTION: The objective compound having structure of the formula (R1 is H, an alkyl, nitro, etc.; R2 is H or methyl; (m) is 1-3; (n) is 0-10) is obtained, preferably, by making an epoxy resin produced by reaction of 6,6- dihydroxy-3,3,3',3'-tetramethyl-1,1'-spirobiindane with an epihalohydrin in the presence of a dehydrohalogenation catalyst react with acrylic acid and/or methacrylic acid. The reaction of the epoxy resin with the acrylic acid and/or methacrylic acid is preferably carried out in the presence of such a catalyst as triethylamine and such a polymerization inhibitor as hydroquinone in a diluent at 80-130 deg.C for 3-50hr.

Epoxyacrylate resin and its use

PROBLEM TO BE SOLVED: To obtain the subject new compound excellent in compatibility with fluoroalkane-based cooling medium such as 1,1,2-tetrafluoroethane over a wide temperature range, capable of imparting excellent stability and low absorbability to lubricating oils, thus useful for e.g. lubricating oils for the freezing system. SOLUTION: This new compound is expressed by formula I [A is ethylene or isopropylene; R and R are each H, a (substituted) alkyl, (substituted) alkoxyl, halogen or OH; Rf is a 1-25C (partially substituted) fluorocarbon group 0.6-3 in atom number ratio F/C; (l) and (s) are each 1-3; (m) and (n) are each 0-100, (m+n) is not zero], e.g. 6,6'-bis[2-(perfluorobutoxy) ethyloxy]-3,3,3',3'- tetramethyl-1,1'-spirobiindane. The compound of formula I is obtained by reaction of a compound of formula II with a compound of the formula Rf-X (X is Br or I) in the presence of an alkali.

Spirobiindane derivative and use thereof

PROBLEM TO BE SOLVED: To obtain a novolak resin which is useful in such uses as a photosensitive resin compsn. excellent in sensitivity and resolution and an epoxy resin curative excellent in flexibility and resistances to heat and water by selecting a novolak resin having a specified structure. SOLUTION: This resin is a novolak cocondensation resin represented by formula IV and obtd. by reacting a novolak resin represented by formula I [R1 is H, an alkyl, cycloalkyl, alkoxy, nitro, or halogen; R2 and R3 are each H, a (substd.) alkyl, cycloalkyl, benzyl, or phenyl; m is 0-100; and n is 1-3], at least one spirobiindanole compd. represented by formula II, at least one compd. represented by formula III [wherein R4 to R8 are each H, a halogen, (substd.) alkyl, alkenyl, hydroxyl, or acetyl; and x and y are each 0-100], and a carbonyl compd.

Novel novolak resin, its production, and its use

PROBLEM TO BE SOLVED: To provide a resin compsn. having high resolution and high sensitivity required in producing an integrated circuit by incorporating at least one kind of resin having specified repeating units into an alkali-soluble resin. SOLUTION: This resin compsn. contains an alkali-soluble resin contg. 1-100wt.% at least one kind of resin having repeating units represented by formula I or formulae I, II and a 1,2-quinonediazido compd. as a photosensitive agent. In the formulae I, II, each of R -R is optionally substd. alkyl, optionally substd. alkoxy, cycloalkyl, halogen or H and each of (m) and (n) is an integer of 1-100.

Karasawa Akio

Papers

Blue dye for filter

Epoxyacrylate resin and its use

Spirobiindane derivative and use thereof

Novel novolak resin, its production, and its use

Resin composition for photoresist