A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an oxide film formed on one surface of the ceramic body; first and second external electrodes formed on both sides of the oxide film on one surface of the ceramic body; a first internal electrode formed on the dielectric layer and including a first electrode lead-out portion exposed to the first external electrode and a first insulating lead-out portion exposed to the oxide film and having a composite-metal-oxide region formed in an exposed edge portion thereof; a second internal electrode facing the first internal electrode, having the dielectric layer interposed therebetween, and including a second electrode lead-out portion exposed to the second external electrode and a second insulating lead-out portion exposed to the oxide film, having a composite-metal-oxide region formed in an exposed edge portion thereof, and overlapped with the first insulating lead-out portion to form additional capacitance.

Multilayer ceramic electronic component

The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.

Electrically conductive adhesives

A paste composition for an electrode, the paste composition comprising: phosphorous-containing copper alloy particles in which the content of phosphorous is from 6% by mass to 8% by mass; glass particles; a solvent; and a resin

Paste composition for electrode and photovoltaic cell

A ceramic electronic component includes a ceramic body, inner electrodes, a glass coating layer, and outer electrodes. The glass coating layer extends from an exposed portion of one of the inner electrodes at a first end surface to a first principal surface. The outer electrodes are each constituted by a plating film disposed directly above the glass coating layer. The glass coating layer includes a glass medium and metal powder particles that define conductive paths. The metal powder particles have an elongated or substantially elongated shape and are dispersed in the glass medium. The dimension of a portion of the glass coating layer located on the first principal surface in the length direction, is larger than that of a portion of the glass coating layer located on the first end surface in the thickness direction.

Ceramic electronic component

Copper powder is provided, which, while having fine granularity and resistance to oxidation, does not lose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.05 to 10 atomic % Bi inside each particle.

Copper powder for conductive paste, and conductive paste

The present invention is mainly for providing a flake copper powder for a conductive paste with particle properties which are defined by that the particle thickness is thinner being possible for use to form an electrode or a circuit, and a production process thereof. To achieve the object of producing the following particles, each powder particles shape is plastically processed into a flake-shape, wherein the flake copper powder has a cumulative particle diameter D 50 of 10 μm or smaller measured with laser diffraction scattering particle size distribution method. The D 10 , D 50 and D 90 measured with the laser diffraction scattering particle size distribution method are illustrative and the SD/D 50 value measured by the standard deviation of particle distribution with the laser diffraction scattering particle size distribution, is 0.55 or larger and/or a D 90 /D 10 of 4.5 or smaller. The flake copper powder is compressed with a high energy ball mill whose media beads having fine particle diameter which plastically deforms the copper particles into flake-shaped particles, so that stable flake copper powder is produced.

Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder

PROBLEM TO BE SOLVED: To provide tin-coated copper powder particularly as composite electrically conductive metal power for a substitute for lead-free solder composed of fine particles with the particle diameter of ≤5 μm, having excellent dispersibility and capable of low temperature sintering, and which can form an electrically conductive part. SOLUTION: The tin-coated copper powder is constituted so that the particles of copper powder are used as a core material, and the surface of each particle is provided with a tin-coated layer, wherein the particles of copper powder in which the value of the average particle diameter is 0.1 to 5 μm are used as the core material, and the surface of each particle of the copper powder is provided with a tin-coated layer of 40 to 70 wt.%. COPYRIGHT: (C)2006,JPO&NCIPI

Tin-coated copper powder and composite electrically conductive paste using the tin-coated copper powder

This invention is a silver powder having a low-temperature sintering performance and dispersibility, which allows the powder particles to be agglomerated to a small degree and be nearly in the monodisperse state. Employed is silver powder of fine silver particles each to which fine silver particles adhere, wherein fine silver particles of nano-order particle size are adhered to the surface of each silver powder particle. The powder particles of the silver powder of fine silver particles each to which fine silver particles adhere have excellent dispersibility. In the production of the silver powder of fine silver particles each to which fine silver particles adhere, a process of including the steps of: adding a silver nitrate and a neutralizing agent into a slurry of silver powder in a dispersing medium; dissolving the mixture while stirring to allow fine silver oxide particles to be precipitated on the surface of each silver powder particle; washing the resultant silver powder; and exposing the fine silver oxide particles to UV rays to reduce the same to fine silver particles.

Silver powder made of silver particles, each to which fine silver particles adhere and process of producing the same

PROBLEM TO BE SOLVED: To provide a copper powder which does not impair the balance of any of oxidation resistance and electroconductivity though the particle size is very small, and further a copper powder containing little oxygen for an electroconductive paste, of which the variation in the shapes and the particle sizes is small. SOLUTION: The copper powder for the electroconductive paste contains 0.05-10 atom.% Bi inside the particle and also contains 0.01-0.3 atom.% P (phosphorus) inside the particle. COPYRIGHT: (C)2010,JPO&INPIT

Katsuhiko Yoshimaru

Papers

Copper powder for conductive paste, and conductive paste

Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder

Tin-coated copper powder and composite electrically conductive paste using the tin-coated copper powder

Silver powder made of silver particles, each to which fine silver particles adhere and process of producing the same

Copper powder for electroconductive paste, and electroconductive paste